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公开(公告)号:US20250104980A1
公开(公告)日:2025-03-27
申请号:US18628334
申请日:2024-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changbae PARK , Ki-ll KIM , Jongchul PARK , Jae Sik AN , Suntaek LIM
IPC: H01J37/32
Abstract: A substrate processing apparatus includes a process chamber providing a process space, a stage configured to support a substrate, a gas injection unit spaced upward from the stage in the process space, and a spin polarizer having a ring shape and spaced upward from the stage. The spin polarizer includes a polarizer body having a ring shape, and a thin layer on a surface of the polarizer body. The thin layer includes a ferromagnetic material.
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公开(公告)号:US20250104967A1
公开(公告)日:2025-03-27
申请号:US18596976
申请日:2024-03-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: CHANGBAE PARK , KI-IL KIM , Jae Sik AN , SUNTAEK LIM
IPC: H01J37/32 , H01L21/3065
Abstract: Disclosed are substrate processing apparatuses and substrate processing methods using the same. The substrate processing apparatus comprises a process chamber that provides a process space; a stage that supports a substrate, a gas spray device in the process space and upwardly spaced apart from the stage, a dielectric layer in the process space and upwardly spaced apart from the stage, a piezoelectric element that has a connection with and vibrates the dielectric layer, and a piezo power source that supplies the piezoelectric element with an alternating electric power.
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