公开(公告)号：US20250104980A1

公开(公告)日：2025-03-27

申请号：US18628334

申请日：2024-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changbae PARK ,  Ki-ll KIM ,  Jongchul PARK ,  Jae Sik AN ,  Suntaek LIM

IPC: H01J37/32

Abstract: A substrate processing apparatus includes a process chamber providing a process space, a stage configured to support a substrate, a gas injection unit spaced upward from the stage in the process space, and a spin polarizer having a ring shape and spaced upward from the stage. The spin polarizer includes a polarizer body having a ring shape, and a thin layer on a surface of the polarizer body. The thin layer includes a ferromagnetic material.

公开(公告)号：US20250104967A1

公开(公告)日：2025-03-27

申请号：US18596976

申请日：2024-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHANGBAE PARK ,  KI-IL KIM ,  Jae Sik AN ,  SUNTAEK LIM

IPC: H01J37/32 ,  H01L21/3065

Abstract: Disclosed are substrate processing apparatuses and substrate processing methods using the same. The substrate processing apparatus comprises a process chamber that provides a process space; a stage that supports a substrate, a gas spray device in the process space and upwardly spaced apart from the stage, a dielectric layer in the process space and upwardly spaced apart from the stage, a piezoelectric element that has a connection with and vibrates the dielectric layer, and a piezo power source that supplies the piezoelectric element with an alternating electric power.