SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

    公开(公告)号:US20250104967A1

    公开(公告)日:2025-03-27

    申请号:US18596976

    申请日:2024-03-06

    Abstract: Disclosed are substrate processing apparatuses and substrate processing methods using the same. The substrate processing apparatus comprises a process chamber that provides a process space; a stage that supports a substrate, a gas spray device in the process space and upwardly spaced apart from the stage, a dielectric layer in the process space and upwardly spaced apart from the stage, a piezoelectric element that has a connection with and vibrates the dielectric layer, and a piezo power source that supplies the piezoelectric element with an alternating electric power.

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