公开(公告)号：US20250104967A1

公开(公告)日：2025-03-27

申请号：US18596976

申请日：2024-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHANGBAE PARK ,  KI-IL KIM ,  Jae Sik AN ,  SUNTAEK LIM

IPC: H01J37/32 ,  H01L21/3065

Abstract: Disclosed are substrate processing apparatuses and substrate processing methods using the same. The substrate processing apparatus comprises a process chamber that provides a process space; a stage that supports a substrate, a gas spray device in the process space and upwardly spaced apart from the stage, a dielectric layer in the process space and upwardly spaced apart from the stage, a piezoelectric element that has a connection with and vibrates the dielectric layer, and a piezo power source that supplies the piezoelectric element with an alternating electric power.