公开(公告)号：US20170359522A1

公开(公告)日：2017-12-14

申请号：US15483193

申请日：2017-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Hyoung PARK ,  Jeong-Won LEE ,  Chong-Sam CHUNG

IPC: H04N5/265 ,  H04N5/355 ,  G02B3/00 ,  H04N9/69

CPC classification number: H04N5/265 ,  G02B3/0006 ,  H04N5/23212 ,  H04N5/23232 ,  H04N5/2356 ,  H04N5/355 ,  H04N9/69

Abstract: An electronic device and a control method therefor are provided. The electronic device includes a main lens, an image sensor, and at least one processor. When an input for acquiring an image is received, the at least one processor is configured to acquire, from the at least one main lens, a first image including an object by setting the image sensor to a first position corresponding to a first focal point for the object, acquire, from the at least one main lens, a second image including the object by setting the image sensor to a second position corresponding to a second focal point for the object, and combine the acquired first image and the acquired second image to generate a combined image. The first focal point and the second focal point are positions symmetrical to each other with reference to an on-focus position for the object.

公开(公告)号：US20190394383A1

公开(公告)日：2019-12-26

申请号：US16464458

申请日：2017-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Young KIM ,  Na-Youn PARK ,  Jae-Hyoung PARK ,  Jung-Su HA ,  Gyu-Cheol CHOI

IPC: H04N5/235 ,  H04N5/225 ,  G03B15/02

Abstract: An electronic device according to various embodiments comprises a camera module, a communication module, and a processor electrically connected to the camera module and the communication module, wherein the processor acquires an exposure value for an image inputted using the camera module, acquires lighting control-related information from at least one lighting device on the basis of a network connected using the communication module, and can generate a signal for adjusting at least one piece of the lighting control-related information of the at least one lighting device on the basis of the exposure value and a preset lighting control-related information set value. In addition, other embodiments are possible.

公开(公告)号：US20180198982A1

公开(公告)日：2018-07-12

申请号：US15833580

申请日：2017-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Won LEE ,  Jae-Joon MOON ,  Han-Sung KIM ,  Jae-Hyoung PARK

IPC: H04N5/232

CPC classification number: H04N5/23293 ,  H04N5/144 ,  H04N5/23219 ,  H04N5/23238 ,  H04N5/23258

Abstract: Methods for capturing images using camera-equipped electronic devices and electronic devices are provided. The electronic device includes a display, a camera, at least one sensor, and a processor electrically connected with the display, the camera, and the at least one sensor, wherein the processor is configured to receive a signal for obtaining an image, obtain a preview image through the camera in response to the received signal, identify a first motion of the electronic device through the at least one sensor while the preview image obtained through the camera is displayed through the display, and control the electronic device based on the identified first motion and the preview image.

公开(公告)号：US20180017595A1

公开(公告)日：2018-01-18

申请号：US15407660

申请日：2017-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Yong PARK ,  Sang-Boo KANG ,  Jae-Geun KIM ,  Sung-Hyup KIM ,  Jeong-Min NA ,  Jae-Hyoung PARK ,  Sang-Kyu YOO ,  Jae-Hoon JOO

IPC: G01R1/073 ,  G01R1/04

CPC classification number: G01R1/07342 ,  G01R1/04 ,  G01R31/2889

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.