公开(公告)号：US20250079249A1

公开(公告)日：2025-03-06

申请号：US18791760

申请日：2024-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongbeom Ko ,  Kyounglim Suk ,  Jaegun Shin ,  Sanghoon Lee ,  Woojin Jang ,  Gwangjae Jeon

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L25/18

Abstract: A semiconductor package includes a buffer die, an intermediate core die stack on the buffer die, where the intermediate core die stack includes a plurality of intermediate core dies and a plurality of first gap filling portions that respectively overlap side surfaces of the plurality of intermediate core dies in a first direction, a top core die on the intermediate core die stack, and a second gap filling portion that overlaps side surfaces of the intermediate core die stack in the first direction and side surfaces of the top core die in the first direction.