公开(公告)号：US11490550B2

公开(公告)日：2022-11-01

申请号：US17060785

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chunghyo Jung ,  Jaedeok Lim ,  Hyein Park ,  Jaehyoung You

IPC: H05K7/14 ,  H05K7/18 ,  H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K5/00

Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.