-
公开(公告)号：US11490550B2
公开(公告)日：2022-11-01
申请号：US17060785
申请日：2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chunghyo Jung , Jaedeok Lim , Hyein Park , Jaehyoung You
Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.
-
公开(公告)号：US11098959B2
公开(公告)日：2021-08-24
申请号：US17094293
申请日：2020-11-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
-
公开(公告)号：US10798849B2
公开(公告)日：2020-10-06
申请号：US16515275
申请日：2019-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
IPC: H05K7/20 , F28D15/02 , H01L23/427 , G06F1/20 , H05K9/00
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
-
公开(公告)号：US11047628B2
公开(公告)日：2021-06-29
申请号：US15999729
申请日：2017-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
-
公开(公告)号：US20150220122A1
公开(公告)日：2015-08-06
申请号：US14614296
申请日：2015-02-04
Applicant: Samsung Electronics Co., Ltd. , TTM, Co. Ltd.
Inventor： Bongjae Rhee , Chunghyo Jung , Eugene Choi
IPC: G06F1/20
CPC classification number: G06F1/203 , G06F1/1626 , G06F1/1656
Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.
Abstract translation: 一种手持式装置，包括包括至少一个电子部件的电路板，设置在所述电子部件上的热管，用于吸收从所述电子部件产生的热量并且在与所述电子部件相反的方向上释放所吸收的热量;以及散热材料 被配置为将电路板和热管彼此粘合。 热管包括设置在主处理器上以吸收从主处理器产生的热量的蒸发部分，设置在主板的侧面区域上的连接部分，以沿与主处理器相反的方向传递吸收的热量，以及冷凝 部分配置为释放传递的热量。
-
Patent Agency Ranking
公开(公告)号：US11366486B2
公开(公告)日：2022-06-21
申请号：US17262798
申请日：2019-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chunghyo Jung , Jung Nam , Jungeun Lee , Sangwon Chae
Abstract: According to various embodiments, an electronic device comprises a temperature sensor, a display, and a processor configured to operate by using a clock speed selected from among a plurality of clock speeds, wherein the processor may be configured to: execute a designated application by using one selected from among the plurality of clock speeds; check an external temperature by using the temperature sensor for at least some time during the execution of the designated application; when the external temperature falls to within a range of a first designated temperature, execute the designated application by using one selected from among the plurality of clock speeds according to a designated clock governor; and when the external temperature falls to within a range of a second designated temperature that is lower than the first designated temperature, execute the designated application by using one selected from among the plurality of clock speeds, except for some higher clock speeds, according to the designated clock governor. In addition, various other embodiments are possible.
-
公开(公告)号：US09864419B2
公开(公告)日：2018-01-09
申请号：US14614296
申请日：2015-02-04
Applicant: Samsung Electronics Co., Ltd. , TTM, Co. Ltd.
Inventor： Bongjae Rhee , Chunghyo Jung , Eugene Choi
CPC classification number: G06F1/203 , G06F1/1626 , G06F1/1656
Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.
-
公开(公告)号：US11800632B2
公开(公告)日：2023-10-24
申请号：US17262973
申请日：2019-07-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yonghwa Kim , Min Park , Dongil Son , Hyunwoo Sim , Jaedeok Lim , Chunghyo Jung , Seungbum Choi
IPC: H05K1/02
CPC classification number: H05K1/0207 , H05K1/0209 , H05K1/0219
Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.
-
公开(公告)号：US11627654B2
公开(公告)日：2023-04-11
申请号：US16999487
申请日：2020-08-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chunghyo Jung
Abstract: An electronic device according to various embodiments may include: a circuit board; an electrical element disposed on an upper surface of the circuit board; a shield can surrounding at least a portion of the electrical element and having a first opening provided through a portion of the shield can facing the electrical element; a shielding sheet including a shielding layer disposed on at least a portion of the shield can and a support layer disposed on an upper surface of the shielding layer and including a second opening corresponding to the first opening; and a first heat transfer member comprising a heat dissipating material having at least a portion disposed inside the second opening and at least one surface in contact with the shielding layer.
-
公开(公告)号：US11555657B2
公开(公告)日：2023-01-17
申请号：US17375626
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.017 seconds)
