中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.016 seconds)

    Shielding member and electronic device including the same
    1.
    发明授权
    Shielding member and electronic device including the same 有权

    公开(公告)号：US11553629B2

    公开(公告)日：2023-01-10

    申请号：US17142705

    申请日：2021-01-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Myeonggil Lee ,  Hyein Park ,  Jangsun Yoo ,  Jaedeok Lim ,  Jihye Moon ,  Cheehwan Yang ,  Kwangyong Lee ,  Moonhee Lee

    IPC: H05K9/00 ,  H05K7/20 ,  H01L25/18 ,  H05K1/18

    Abstract: An electronic device including a shielding member for performing an electromagnetic interference (EMI) shielding function is provided. The electronic device includes a printed circuit board including a first area in which first electronic components having a first frequency as a driving frequency are mounted, and a second area in which second electronic components having a second frequency as a driving frequency are mounted, a shielding film disposed to cover the first area and the second area of the printed circuit board and attached to a first ground portion of the printed circuit board, and at least one conductive member formed to extend in a direction perpendicular to an extending direction of the printed circuit board. The at least one conductive member includes a first end that contacts the shielding film, and a second end that contacts a second ground portion of the printed circuit board, the second end being disposed between the first area and the second area of the printed circuit board.

    Antenna radiator including plurality of layers and electronic device including the same
    2.
    发明授权
    Antenna radiator including plurality of layers and electronic device including the same 有权

    公开(公告)号：US11258174B2

    公开(公告)日：2022-02-22

    申请号：US16861415

    申请日：2020-04-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yoonjung Kim ,  Jaedeok Lim ,  Gyuyeong Cho ,  Hyein Park

    IPC: H01Q1/24 ,  H01Q9/04

    Abstract: Disclosed is an electronic device including a housing, a first plate positioned on a front surface of the housing, a second plate positioned on a rear surface of the housing, an antenna radiator interposed between the first plate and the second plate, and a wireless communication circuit connected to the antenna radiator and processing a signal in a specific frequency band. The antenna radiator includes at least one conductive fabric layer having a resistance characteristic suitable for transmitting or receiving the signal in the specific frequency band, and the at least one conductive fabric layer includes a fabric that is plated with at least one metal.

    Electronic device including heat radiating structure
    4.
    发明授权
    Electronic device including heat radiating structure 有权

    公开(公告)号：US11490550B2

    公开(公告)日：2022-11-01

    申请号：US17060785

    申请日：2020-10-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chunghyo Jung ,  Jaedeok Lim ,  Hyein Park ,  Jaehyoung You

    IPC: H05K7/14 ,  H05K7/18 ,  H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K5/00

    Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.

    Electronic device having conductive structure of supporting member
    6.
    发明授权
    Electronic device having conductive structure of supporting member 有权

    公开(公告)号：US11457528B2

    公开(公告)日：2022-09-27

    申请号：US16894094

    申请日：2020-06-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jamyeong Koo ,  Jaedeok Lim ,  Hyein Park ,  Gyuyeong Cho

    IPC: H01Q1/24 ,  H05K1/02 ,  H01Q1/12 ,  H05K3/30

    Abstract: An electronic device is provided. The electronic device includes an electronic device including a housing including a front plate, a rear plate, and a member surrounding at least part of a space between the front plate and the rear plate and operating as an antenna radiator by being formed of a metal material at least in part, a support member including a first face and a second face, disposed between a display and the rear plate, supporting the display on the first face, and bonded to part of the side member, a printed circuit board, a housing groove formed on a first portion of the member, a conductive body bonded to the housing groove through a press-fit process, and a connection terminal disposed on the printed circuit board and electrically coupling the press-fitted conductive body to the printed circuit board.

    Shielding film including plurality of layers and electronic device using the same
    7.
    发明授权
    Shielding film including plurality of layers and electronic device using the same 有权

    公开(公告)号：US11291144B2

    公开(公告)日：2022-03-29

    申请号：US16669592

    申请日：2019-10-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Myeonggil Lee ,  Hyein Park ,  Jaedeok Lim ,  Jihye Moon ,  Cheehwan Yang ,  Jangsun Yoo ,  Kwangyong Lee

    IPC: H05K9/00 ,  H05K7/20

    Abstract: An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

Patent Agency Ranking