公开(公告)号：US11715653B2

公开(公告)日：2023-08-01

申请号：US16694213

申请日：2019-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeonghoon Kim ,  Byunghwan Kong ,  Seungyong Bae ,  Jaehyun An

IPC: H01L21/67

CPC classification number: H01L21/67109 ,  H01L21/6719 ,  H01L21/67115

Abstract: A substrate processing apparatus includes a process chamber, a support part, disposed in the process chamber, having a substrate loading region in which a substrate is seated, a heating part disposed in a location opposing the substrate loading region to heat the substrate loading region, and a reflective member, disposed in a location opposing the substrate loading region in the process chamber, in which a sealed hollow portion is disposed.