公开(公告)号：US11688050B2

公开(公告)日：2023-06-27

申请号：US15960701

申请日：2018-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Chul Park ,  Jeong Hoon Ko ,  Ji Yong Park ,  Je Hyun Lee ,  Dae Sin Kim

IPC: G06T7/00 ,  G06V10/762 ,  G06V10/764 ,  H01L21/66 ,  G06F18/23 ,  G06F18/24 ,  G06F18/2413

CPC classification number: G06T7/0004 ,  G06F18/23 ,  G06F18/24 ,  G06F18/24137 ,  G06V10/762 ,  G06V10/764 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148 ,  G06V2201/06

Abstract: A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.

公开(公告)号：US09954966B2

公开(公告)日：2018-04-24

申请号：US14806797

申请日：2015-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo Hyuk Jang ,  Jae Hyun Park ,  Hey Young Park ,  Jong Kyu Bae ,  Yeo Rok Yoon ,  Ki Won Lee ,  Je Hyun Lee ,  Ki Young Lim ,  Jong Yeol Choi

IPC: G06F15/16 ,  H04L29/08 ,  H04L29/06

CPC classification number: H04L67/26 ,  H04L67/18 ,  H04L67/42

Abstract: A server is provided comprising a processor configured to: receive an indication of a location of a first device that is subscribed to a disaster notification service; in response to receiving a disaster alert, detect that the first device is located in an area associated with the disaster based on the indication of the location of the first device; identify a second device that has registered the first device as a friend; and transmit a first indication of the disaster to the first device and a second indication of the disaster to the second device.