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公开(公告)号：US20220295647A1
公开(公告)日：2022-09-15
申请号：US17824142
申请日：2022-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunho KIM , Jehyun SON , Taewon KIM
Abstract: An electronic device is provided. The electronic device includes a display forming the front surface of the electronic device, a housing in which the display is seated and which at least forms a first side surface of the electronic device, an opening provided in the first side surface formed by the housing, a printed circuit board disposed adjacent to the first side surface, a connecting interface disposed on the PCB so as to be electrically connected to an external connector when the external connector is inserted through the opening, and a reinforcement member disposed on the PCB so as to surround the side surface of the connecting interface without covering the top surface of the connecting interface.
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Patent Agency Ranking
公开(公告)号：US20200293460A1
公开(公告)日：2020-09-17
申请号：US16813140
申请日：2020-03-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jehyun SON , Jugab LEE , Kyoungup KIM , Chaehoon LIM , Dusun CHOI
Abstract: In one embodiment, an electronic device controls an external conversion device connected to an external device. The electronic device includes a connection terminal formed on a portion of an outer surface thereof, a first converter connected to the connection terminal and configured to convert signals, and a processor operatively connected to the first converter. The processor is configured, when the external conversion device is connected to the connection terminal, and the external device is connected to the external conversion device, to identify a type of the external device connected to the external conversion device by receiving an operation signal of the external device through the external conversion device, the connection terminal, and the first converter, and to input or output a signal corresponding to the external device through the external conversion device.
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公开(公告)号：US20230319380A1
公开(公告)日：2023-10-05
申请号：US18206716
申请日：2023-06-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jisoo CHOI , Jehyun SON , Dusun CHOI
CPC classification number: H04N23/51 , H05K1/028 , G06F1/1686 , H05K1/189 , H04N23/57 , H05K2201/10356
Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof, and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.
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公开(公告)号：US20210029275A1
公开(公告)日：2021-01-28
申请号：US16884446
申请日：2020-05-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jisoo CHOI , Jehyun SON , Dusun CHOI
Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.
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公开(公告)号：US20230254393A1
公开(公告)日：2023-08-10
申请号：US18113257
申请日：2023-02-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Gyuyeon JEON , Jehyun SON , Youngjoon AHN , Minsu RHEE
CPC classification number: H04M1/0277 , H05K9/0081
Abstract: According to an example embodiment of the disclosure, an electronic device may include a first printed circuit board, a second printed circuit board, multiple first conductive portions, multiple second conductive portions, and multiple third conductive portions. The second printed circuit board may be disposed to at least partially overlap the first printed circuit board. The multiple first conductive portions may be arranged in a first area between the first printed circuit board and the second printed circuit board. The multiple first conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple second conductive portions may be arranged in a second area, surrounding at least a part of the first area, between the first printed circuit board and the second printed circuit board. The multiple second conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple third conductive portions may be arranged in the second area. The multiple third conductive portions may electrically connect at least two of the multiple second conductive portions. The multiple second conductive portions may electrically connect a first ground area included in the first printed circuit board and a second ground area included in the second printed circuit board.
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公开(公告)号：US20220247893A1
公开(公告)日：2022-08-04
申请号：US17721412
申请日：2022-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jisoo CHOI , Jehyun SON , Dusun CHOI
Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.
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