公开(公告)号：US20240318040A1

公开(公告)日：2024-09-26

申请号：US18609533

申请日：2024-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yearin Byun ,  Jeongwon Lim ,  Boyun Kim ,  Sanghyun Park ,  Seungho Park

IPC: C09G1/04 ,  H01L21/3205 ,  H01L21/321

CPC classification number: C09G1/04 ,  H01L21/3212 ,  H01L21/32051

Abstract: Provided is a chemical mechanical polishing (CMP) slurry composition including an organic booster including an amino acid, a pH adjuster, and inorganic abrasive particles of less than 0.1 weight % with respect to a total weight of the CMP slurry composition, wherein a material constituting a remaining part of the CMP slurry composition is deionized water (DIW).