公开(公告)号：US12222818B2

公开(公告)日：2025-02-11

申请号：US18112702

申请日：2023-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyun Park ,  Taikuin Mun ,  Gunho Lee ,  Jaehyeok Lee ,  Taesub Kim ,  Heangsu Kim ,  Myungkeun Oh ,  Seunghyup Lee ,  Hwansoo Jeon ,  Hakbong Cho ,  Sunghyun An

IPC: H04L67/12 ,  G06F1/16 ,  G06F11/14 ,  H04L67/141

Abstract: A method and a device configured to transmit information related to a device to a first electronic device through a communication module in accordance with a request of the first electronic device; establish a communication connection with a second electronic device based on the information; receive a backup request for data stored in the device from the first electronic device; generate backup data based on the backup request; transmit the generated backup data to the second electronic device; and reset the device based on a device reset request in a case of receiving the device reset request from the second electronic device.

公开(公告)号：US20240318037A1

公开(公告)日：2024-09-26

申请号：US18609795

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yearin Byun ,  Eunock Kim ,  Suyeong Jung ,  Hyungoo Kong ,  Inkwon Kim ,  Sanghyun Park

IPC: C09G1/02 ,  H01L21/3205 ,  H01L21/321

CPC classification number: C09G1/02 ,  H01L21/3212 ,  H01L21/32051

Abstract: The present disclosure relates to slurry compositions used for chemical mechanical polishing of a metal film. An example slurry composition includes abrasive particles, deionized water, and an oxidizer. The oxidizer includes iodine, and is a temperature-sensitive oxidizer capable of controlling both a static etch rate and a removal rate of the metal film when a polishing temperature during the chemical mechanical polishing is about 5° C. to about 100° C.

公开(公告)号：US20200211073A1

公开(公告)日：2020-07-02

申请号：US16727074

申请日：2019-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namjin Kim ,  Junghwan Song ,  Sanghyun Park ,  Yoechan Song

IPC: G06Q30/06

Abstract: An electronic device and method are disclosed. The device includes a communication module, at least one processor operatively coupled to the communication module, and at least one memory. The processor implements the method, including: retrieving a plurality of service categories, each service category listing services providable to a user using one or more smart devices, and each service category associated with a service capability list of one or more elements indicating whether each service category is to be recommended to the user, receiving user-related information from the external device through the communication module and updating a service capability list of a user using the user-related information, and selecting a service category from among the retrieved plurality of service categories to be recommended to the user by comparing the updated service capability list of the user with the service capability lists associated with each of the plurality of service categories.

公开(公告)号：US10002822B2

公开(公告)日：2018-06-19

申请号：US15089604

申请日：2016-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： MuSeob Shin ,  Won-young Kim ,  Sanghyun Park ,  Jinchan Ahn

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A circuit board and a semiconductor packages therewith are disclosed. The circuit board may include a top surface, on which at least one semiconductor chip is mounted, and a bottom surface, to which at least one outer terminal is coupled. The top surface may include an upper window region, on which an upper conductive pattern electrically connected to the semiconductor chip is provided, and the bottom surface may include a lower window region, on which a lower conductive pattern electrically connected to the upper conductive pattern is provided. Here, a ratio of an area of the lower conductive pattern to an area of the upper conductive pattern may be less than or equal to 1.5.

公开(公告)号：US20240397726A1

公开(公告)日：2024-11-28

申请号：US18655488

申请日：2024-05-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilho Myeong ,  Yongseok Kim ,  Taeyoung Kim ,  Suseong Noh ,  Sanghyun Park ,  Suhwan Lim ,  Daewon Ha

IPC: H10B51/20 ,  H01L25/065 ,  H01L29/66 ,  H01L29/78 ,  H10B51/10 ,  H10B80/00

Abstract: A semiconductor device includes a stacked structure including a plurality of gate lines and a plurality of insulation patterns that are alternately stacked in a vertical direction, where the stacked structure defines a vertical hole that extends into the stacked structure and in the vertical direction, a channel film that extends into a vertical hole, and a multiple dielectric layer structure between the channel film and the stacked structure, where the multiple dielectric layer structure includes a plurality of interlayer dielectric layers and a plurality of ferroelectric layers that are alternately stacked and extend from the channel film toward the stacked structure, and where an inner ferroelectric layer of the plurality of ferroelectric layers is thicker than an outer ferroelectric layer of the plurality of ferroelectric layers.

公开(公告)号：US20240318040A1

公开(公告)日：2024-09-26

申请号：US18609533

申请日：2024-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yearin Byun ,  Jeongwon Lim ,  Boyun Kim ,  Sanghyun Park ,  Seungho Park

IPC: C09G1/04 ,  H01L21/3205 ,  H01L21/321

CPC classification number: C09G1/04 ,  H01L21/3212 ,  H01L21/32051

Abstract: Provided is a chemical mechanical polishing (CMP) slurry composition including an organic booster including an amino acid, a pH adjuster, and inorganic abrasive particles of less than 0.1 weight % with respect to a total weight of the CMP slurry composition, wherein a material constituting a remaining part of the CMP slurry composition is deionized water (DIW).

公开(公告)号：US10153214B2

公开(公告)日：2018-12-11

申请号：US15386843

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se Jung Park ,  Ju-Hyun Kim ,  Hoyoung Kim ,  Boun Yoon ,  TaeYong Kwon ,  Sangkyun Kim ,  Sanghyun Park

IPC: H01L27/088 ,  H01L29/78 ,  H01L21/8238 ,  H01L29/66 ,  H01L21/84 ,  H01L21/3105 ,  H01L21/306 ,  H01L27/092

Abstract: A patterning method for fabricating a semiconductor device includes forming, for example sequentially forming, a lower buffer layer, a first channel semiconductor layer, and a capping insulating layer on a substrate, forming an opening to penetrate the capping insulating layer and the first channel semiconductor layer and expose a portion of the lower buffer layer, forming a second channel semiconductor layer to fill the opening and include a first portion protruding above the capping insulating layer, performing a first CMP process to remove at least a portion of the first portion, removing the capping insulating layer, and performing a second CMP process to remove at least a portion of a second portion of the second channel semiconductor layer protruding above the first channel semiconductor layer.

公开(公告)号：US12242067B2

公开(公告)日：2025-03-04

申请号：US18344241

申请日：2023-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunho Kim ,  Kyunghwa Kim ,  Sanghyun Park ,  Minseoung Woo ,  Sanga Yoo ,  Hyunjun Lee

IPC: G06F3/048 ,  G02B27/00 ,  G02B27/01 ,  G06F1/16 ,  G06F3/01 ,  G06F3/0481 ,  G06T19/00

Abstract: A wearable device is provided. The wearable device includes a camera, and a processor. The processor may be configured to display, based on a direction in which a region in an image faces being different from a reference direction, a widget or a first visual object including at least a part of information, in at least a part of the region in the image. The processor may be configured to display, based on the direction in which the region in the image faces being corresponding to the reference direction, a second visual object representing a virtual outdoor environment with a weather condition, in the region in the image.

公开(公告)号：US11622097B2

公开(公告)日：2023-04-04

申请号：US16763087

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonkyu Park ,  Minhwa Hong ,  Yeojin Kim ,  Sanghyun Park ,  Hyeonju Lee ,  Stephanie Kim Ahn

IPC: H04N13/167 ,  H04N13/183 ,  H04N13/349 ,  H04N13/398 ,  H04N5/232 ,  H04N21/431 ,  H04N21/472 ,  H04N21/4728 ,  H04N21/81 ,  H04N21/422 ,  H04N21/47 ,  G06F3/0354 ,  G06F3/0482 ,  G06F3/0485

Abstract: An electronic device is disclosed. In addition, various embodiments identified through the specification are possible. The electronic device includes a display, a processor, and a memory storing instructions that, when executed by the processor, cause the processor to display, when a video supporting a plurality of orientation regions is played, a first screen corresponding to a first orientation region among the plurality of orientation regions, display a timeline representing a playback time of the video, display thumbnails of screens corresponding to the plurality of orientation regions at the first time point in response to a first user input pointing a first time point in the timeline, and receive a second user input scrolling the thumbnails.

公开(公告)号：US11041097B2

公开(公告)日：2021-06-22

申请号：US16661287

申请日：2019-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-il Park ,  Myeong Hoon Han ,  Sanghyun Park ,  Wonki Hur ,  Seungho Park ,  Hao Cui

IPC: C09G1/02 ,  H01L27/24 ,  H01L45/00

Abstract: A polishing composition and a method of fabricating a semiconductor device using the same, the polishing composition including an abrasive; a first additive that includes a C5 to C30 hydrocarbon including an amide group and a carboxyl group or a C5 to C30 hydrocarbon including two or more amine groups; and a second additive that includes a sulfonic acid, a sulfonate, or a sulfonate salt.