公开(公告)号：US20240431102A1

公开(公告)日：2024-12-26

申请号：US18414551

申请日：2024-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyeon Kim ,  Donghoon Kwon

IPC: H10B43/27 ,  H10B41/27

Abstract: A semiconductor device according to an embodiment includes: a gate stacking structure that comprises a first stacking structure and a second stacking structure on the first stacking structure, the first stacking structure and the second stacking structure each comprising a plurality of gate electrodes; a channel structure that extends into the gate stacking structure; and a plurality of gate contact portions that are respectively connected to the plurality of gate electrodes of a first pad area of the first stacking structure and a second pad area of the second stacking structure; where the first stacking structure comprises a buffer insulating portion that comprises a boundary portion that is adjacent to the second pad area, where the buffer insulating portion comprises a first section, a second section, and an inner section that is between the first section and the second section in a first direction.

公开(公告)号：US20240238939A1

公开(公告)日：2024-07-18

申请号：US18515780

申请日：2023-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihyeon Kim ,  Donghoon Kwon

IPC: B24B57/02 ,  B08B3/02 ,  B24B37/015

CPC classification number: B24B57/02 ,  B08B3/02 ,  B24B37/015

Abstract: A substrate polishing apparatus includes a platen having an upper surface configured to polish a semiconductor substrate, a slurry supply configured to supply slurry between the semiconductor substrate and the platen, a substrate holder configured to hold the semiconductor substrate and to bring the semiconductor substrate in contact with the upper surface of the platen, the substrate holder having a circular shape, a temperature controller configured to control temperature of the platen through thermal transfer via direct contact, wherein the temperature controller has a thermal conductive body that has an arc shape and the thermal conductive body is spaced apart from the substrate holder and surrounds at least a portion of the substrate holder, and a cleaning component configured to supply a cleaning solution to the substrate holder and the temperature controller.