公开(公告)号：US20230207487A1

公开(公告)日：2023-06-29

申请号：US17876099

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyun KANG ,  Haejung YU ,  Soohyun NAM ,  Ilbok LEE

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package including a substrate including, at an upper surface thereof, an inner area and an edge area surrounding the inner area, a chip set on the inner area of the substrate, a stiffener set on the edge area of the substrate, the stiffener set including a plurality of stiffeners spaced apart from one another, and an adhesive member attaching the plurality of stiffeners to the substrate may be provided.