公开(公告)号：US20230207487A1

公开(公告)日：2023-06-29

申请号：US17876099

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyun KANG ,  Haejung YU ,  Soohyun NAM ,  Ilbok LEE

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package including a substrate including, at an upper surface thereof, an inner area and an edge area surrounding the inner area, a chip set on the inner area of the substrate, a stiffener set on the edge area of the substrate, the stiffener set including a plurality of stiffeners spaced apart from one another, and an adhesive member attaching the plurality of stiffeners to the substrate may be provided.

公开(公告)号：US20230178469A1

公开(公告)日：2023-06-08

申请号：US18054225

申请日：2022-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soohyun NAM ,  Haejung YU

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/182 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1811

Abstract: A semiconductor package includes an interposer including a base layer and a plurality of interposer through-electrodes penetrating the base layer; at least one stacked structure attached to the interposer and including a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, and a chip molding layer on a side surface of the plurality of second semiconductor chips; a plurality of third semiconductor chips attached to the interposer adjacent the at least one stacked structure; and a package molding layer extending around the at least one stacked structure and the plurality of third semiconductor chips on the interposer.

公开(公告)号：US20240321815A1

公开(公告)日：2024-09-26

申请号：US18735408

申请日：2024-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soohyun NAM ,  Younglyong KIM

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L24/73 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16235 ,  H01L2224/32056 ,  H01L2224/32059 ,  H01L2224/32235 ,  H01L2224/73204 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/3512

Abstract: A semiconductor package including an interposer substrate, first to third semiconductor chips on the interposer substrate to face each other, an underfill part between each of the first to third semiconductor chips and the interposer substrate, a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips, and a second side-fill part between the side walls of the first to third semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the first to third semiconductor chips may be provided.

公开(公告)号：US20220189907A1

公开(公告)日：2022-06-16

申请号：US17367995

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soohyun NAM ,  Younglyong KIM

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: A semiconductor package including an interposer substrate, first to third semiconductor chips on the interposer substrate to face each other, an underfill part between each of the first to third semiconductor chips and the interposer substrate, a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips, and a second side-fill part between the side walls of the first to third semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the first to third semiconductor chips may be provided.