公开(公告)号：US11171082B2

公开(公告)日：2021-11-09

申请号：US16661345

申请日：2019-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihoon Kim ,  Mijin Park ,  Jinwon Lee

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L23/13 ,  H01L23/00

Abstract: A semiconductor package includes: a connection structure including a plurality of insulating layers and redistribution layers respectively disposed on the plurality of insulating layers; a semiconductor chip having connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip; first and second pads arranged on at least one surface of the connection structure and each having a plurality of through-holes; a surface mount component disposed on the at least one surface of the connection structure and including first and second external electrodes positioned, respectively, in regions of the first and second pads; first and second connection vias arranged in the plurality of insulating layers and connecting the first and second pads to the redistribution layers, respectively; and first and second connection metals connecting the first and second pads and the first and second external electrodes to each other, respectively.

公开(公告)号：US11006030B2

公开(公告)日：2021-05-11

申请号：US16637044

申请日：2018-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwon Lee ,  Kwang Seok Byon ,  Kiwoo Lee ,  Chongsam Chung

IPC: H04N5/225 ,  G06T7/11 ,  H04N5/232

Abstract: Various embodiments of the disclosure relate to an electronic device and a method of acquiring an image of the electronic device. The electronic device may include a first camera, a second camera which includes an image sensor, a mirror for transferring light incident from the outside to the image sensor, and a driving device capable of rotating the mirror in at least one direction along at least one rotation axis, and which has a view angle smaller than a view angle of the first camera, and at least one processor. The at least one processor may be configured to acquire a first image including one or more external objects by using the first camera, select at least some objects of the one or more external objects included in the first image or at least some regions of the first image, and acquire a second image in a state where the mirror is rotated by the driving device such that the view angle of the second camera is moved to a location corresponding to the selected at least some objects or at least some regions. Various other embodiments are also possible.

公开(公告)号：US10527866B2

公开(公告)日：2020-01-07

申请号：US15857027

申请日：2017-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haein Chung ,  Jinwon Lee ,  Chongsam Chung

IPC: G02B27/64 ,  G03B5/02 ,  G02B7/00 ,  H04N5/232

Abstract: A camera module providing an OIS function is disclosed and includes a camera device configured to rotate in a first direction perpendicular to an optical axis, a first rotation support configured to provide support so that the first direction becomes a central axis for rotating the camera device, and a flexible printed circuit board (FPCB) configured to connect the camera device and the first rotation support physically at two or more separate points. A cross sectional shape of the camera module in the direction of a center point of the central axis is configured so that line segments connecting the center point to the two or more separate points, and the cross sectional shape of the flexible printed circuit board form a closed loop, and at least one line segment connecting two random points in the closed loop passes outside of the closed loop.