Electronic device including hinge module

    公开(公告)号:US12216493B2

    公开(公告)日:2025-02-04

    申请号:US18175537

    申请日:2023-02-28

    Abstract: According to various embodiments of the disclosure, an electronic device may includes: a first housing in which a display module is disposed; a second housing in which a circuit board and a cooling fan connected to the circuit board are accommodated, where a first opening is defined in the second housing to introduce air into the cooling fan; and a hinge module rotatably connected to the first housing and the second housing, and disposed adjacent to the first opening. The hinge module may includes: a hinge housing in which a first hinge opening is defined to be connected to the first opening; a first main gear disposed in the hinge housing and operably connected to the first housing; a second main gear operably connected to the second housing and configured to rotate in correspondence with the first main gear; a driving gear disposed adjacent to at least one of the first main gear or the second main gear and rotatable in correspondence with at least one of the first main gear or the second main gear; and a first cover plate disposed in the hinge housing and including a first rack gear area which meshes with the driving gear. The electronic device may be switchable between a closed state in which an angle formed by the first housing and the second housing is less than a predetermined angle and an open state in which the angle formed by the first housing and the second housing is equal to or greater than the predetermined angle. When the electronic device is in the closed state, the first cover plate is disposed to overlap with at least part of the first hinge opening. When the electronic device is in the open state, the first cover plate may be spaced apart from the first hinge opening, and the first hinge opening may be opened.

    Electronic device including heat dissipation sheet

    公开(公告)号:US12250798B2

    公开(公告)日:2025-03-11

    申请号:US17975169

    申请日:2022-10-27

    Abstract: An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.

    Heat dissipation structure and electronic device including same

    公开(公告)号:US11800688B2

    公开(公告)日:2023-10-24

    申请号:US17289285

    申请日:2019-11-01

    CPC classification number: H05K7/20509 G06F1/203 H05K7/20336

    Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.

    Camera module providing OIS function and electronic device comprising the same

    公开(公告)号:US10527866B2

    公开(公告)日:2020-01-07

    申请号:US15857027

    申请日:2017-12-28

    Abstract: A camera module providing an OIS function is disclosed and includes a camera device configured to rotate in a first direction perpendicular to an optical axis, a first rotation support configured to provide support so that the first direction becomes a central axis for rotating the camera device, and a flexible printed circuit board (FPCB) configured to connect the camera device and the first rotation support physically at two or more separate points. A cross sectional shape of the camera module in the direction of a center point of the central axis is configured so that line segments connecting the center point to the two or more separate points, and the cross sectional shape of the flexible printed circuit board form a closed loop, and at least one line segment connecting two random points in the closed loop passes outside of the closed loop.

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