公开(公告)号：US20240031734A1

公开(公告)日：2024-01-25

申请号：US18329074

申请日：2023-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chamin PARK ,  Jonghong KIM ,  Cheongno YUN ,  Soojung LEE

IPC: H04R1/28 ,  H04R1/02

CPC classification number: H04R1/2849 ,  H04R1/023 ,  H04R1/028 ,  H04R1/2803 ,  H04R2499/11

Abstract: An audio output device is provided. The audio output device includes a speaker, a case surrounding the speaker and including a first opening connected to the resonance space within the case, a plurality of air adsorbents disposed within the speaker, an adhesive member disposed on the first opening and including a second opening overlapping the first opening, and a mesh layer disposed on the adhesive member and covering the second opening. A diameter of the first opening is larger than a diameter of each of the plurality of air adsorbents, and a diameter of the second opening is smaller than the diameter of the first opening.