EARPHONES
    1.
    发明公开
    EARPHONES 审中-公开

    公开(公告)号:US20240348971A1

    公开(公告)日:2024-10-17

    申请号:US18649015

    申请日:2024-04-29

    发明人: Junjiang FU

    IPC分类号: H04R1/28 H04R1/10

    摘要: The present disclosure provides an earphone comprising a support component and a core module connected with the support component. The support component configured to support the core module to be worn to a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is disposed in an accommodating cavity of the core housing. The vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user. The core module further includes an auxiliary structure connected with the vibration panel. The auxiliary structure may be configured such that a first frequency response curve of a vibration of the vibration panel in a non-wearing state has a first resonance valley in a target frequency range.

    SYSTEMS AND METHODS FOR IMPROVED ACOUSTO-HAPTIC SPEAKERS

    公开(公告)号:US20240334115A1

    公开(公告)日:2024-10-03

    申请号:US18625808

    申请日:2024-04-03

    申请人: IMMERZ, INC.

    发明人: Shahriar AFSHAR

    IPC分类号: H04R1/28 H04R7/12 H04R9/02

    摘要: Systems and methods relate to, among other things, a transducer capable of producing acoustic and tactile stimulation. The transducer includes a rigid mass element disposed on the diaphragm of a speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The systems and methods advantageously benefit from both the fidelity and audio performance of a full-range speaker while simultaneously producing high-fidelity, adjustable and palpable haptic vibrations.

    ELECTRONIC DEVICE AND SPEAKER MODULE
    3.
    发明公开

    公开(公告)号:US20240323588A1

    公开(公告)日:2024-09-26

    申请号:US18735816

    申请日:2024-06-06

    申请人: Acer Incorporated

    IPC分类号: H04R1/28 H04R1/02

    摘要: A speaker module includes a casing and a speaker unit. The casing has a sound outlet. The speaker unit is arranged in the casing, the speaker unit and the sound outlet are arranged along a transverse axis, and the speaker unit includes a bearing base, a first speaker assembly, and a second speaker assembly. The first and second speaker assemblies are disposed on the bearing base. The first speaker assembly and the second speaker assembly are symmetrical relative to the bearing base. A first sound cavity is formed between the casing and the first speaker assembly, a second sound cavity is formed between the casing and the second speaker assembly, the first sound cavity and the second sound cavity are communicated with the sound outlet, and the first sound cavity and the second sound cavity have the same size and are symmetrical relative to the bearing base.

    Acoustic transducer and electronic device having slim speaker

    公开(公告)号:US12047734B2

    公开(公告)日:2024-07-23

    申请号:US17650974

    申请日:2022-02-14

    摘要: An electronic device includes: a case in which a display is mounted on the front surface thereof; a slim speaker mounted on the rear surface of the case; and a rear cover mounted on the rear surface of the case to cover the slim speaker. The slim speaker includes: an acoustic transducer for generating sound; and an enclosure fixed to the rear cover and having the acoustic transducer mounted therein. The enclosure includes an open upper side on the front surface of the enclosure, and includes: a sound guide groove which exposes a vibration plate of the acoustic transducer and guides the generated sound generated by the vibration plate; an enclosure groove including an open upper side on the rear surface of the enclosure and surrounding the acoustic transducer; and a sound discharge port formed on a side surface of the enclosure and in communication with the sound guide groove.