公开(公告)号：US20170237840A1

公开(公告)日：2017-08-17

申请号：US15430882

申请日：2017-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheongno YUN ,  Jungmin YANG

IPC: H04M1/02 ,  H01R24/58

CPC classification number: H04M1/026 ,  H01R24/58 ,  H04M1/0274 ,  H04M1/6058

Abstract: An electronic device and method of wireless signal transmission and reception therefor are provided. The electronic device may include: a housing having an opening; a connector socket disposed in close proximity to the opening and configured to accommodate an external connector having a plurality of contact terminals through the opening; a ground connected to the connector socket; a codec circuit disposed in the housing and electrically connected with the connector socket; and a communication circuit configured to process a radio signal received from the outside of the electronic device. The connector socket may include a first contact terminal and a second contact terminal that electrically contact one of multiple contact terminals of the external connector when the external connector is inserted into the connector socket. The ground may be electrically connected with the first contact terminal. The codec circuit may include a first port that is electrically connected to the first contact terminal through a first electrical path. The communication circuit may be electrically coupled with the second contact terminal through a second electrical path different from the first electrical path.

公开(公告)号：US20240064912A1

公开(公告)日：2024-02-22

申请号：US18235089

申请日：2023-08-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chungik LEE ,  Gunhee PARK ,  Sengtai LEE ,  Seokmin JANG ,  Cheongno YUN

IPC: H05K5/00 ,  H05K5/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K5/0047 ,  H05K5/0247 ,  H05K1/118 ,  H05K1/147 ,  H05K3/4644 ,  H05K2201/10037 ,  H05K2201/2027

Abstract: According to certain embodiments, an electronic device comprising a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing; a battery disposed between the first printed circuit board and the second printed circuit board; a connection member disposed along one side surface of the battery, and electrically connecting the first printed circuit board and the second printed circuit board; a protection circuit module disposed along the one side surface of the battery and over the connection member; and a first flexible printed circuit board disposed adjacent to the protection circuit module and connected with the first printed circuit board or the second printed circuit board.

公开(公告)号：US20240031734A1

公开(公告)日：2024-01-25

申请号：US18329074

申请日：2023-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chamin PARK ,  Jonghong KIM ,  Cheongno YUN ,  Soojung LEE

IPC: H04R1/28 ,  H04R1/02

CPC classification number: H04R1/2849 ,  H04R1/023 ,  H04R1/028 ,  H04R1/2803 ,  H04R2499/11

Abstract: An audio output device is provided. The audio output device includes a speaker, a case surrounding the speaker and including a first opening connected to the resonance space within the case, a plurality of air adsorbents disposed within the speaker, an adhesive member disposed on the first opening and including a second opening overlapping the first opening, and a mesh layer disposed on the adhesive member and covering the second opening. A diameter of the first opening is larger than a diameter of each of the plurality of air adsorbents, and a diameter of the second opening is smaller than the diameter of the first opening.