公开(公告)号：US20230141690A1

公开(公告)日：2023-05-11

申请号：US17894543

申请日：2022-08-24

申请人： Samsung Electronics Co., Ltd.

发明人： Seungchang BAEK ,  Hyeongsam SON ,  Changhyeok SHIN ,  Yoonhee LEE ,  Junghyun IM ,  Sungho CHO ,  Jungwoo CHOI ,  Hangyu HWANG ,  Minwoo YOO

IPC分类号： H05K5/02

CPC分类号： H05K5/0217 ,  H05K5/0247 ,  H05K5/0018

摘要： An electronic device is provided. The electronic device includes a display, a frame structure including a first conductive member defining an external appearance of the electronic device and operated as an antenna element of the electronic device, a second conductive member coupled and electrically connected to the first conductive member, and a nonconductive member that supports the display together with the second conductive member, a bonding layer including a first layer at least partially disposed between the first conductive member and the nonconductive member, and a second layer at least partially disposed between the second conductive member and the nonconductive member, and at least one conductive connection member disposed at a portion, at which the first conductive member and the second conductive member are coupled to each other, and contacting the first conductive member and the second conductive member.

公开(公告)号：US20240324132A1

公开(公告)日：2024-09-26

申请号：US18731991

申请日：2024-06-03

申请人： Samsung Electronics Co., Ltd.

发明人： Yoonhee LEE ,  Juncheol SHIN ,  Aeree KIM ,  Joungki PARK ,  Seungchang BAEK ,  Junghyun IM ,  Jinhwan JEONG ,  Sungho CHO ,  Hangyu HWANG

IPC分类号： H05K5/04

CPC分类号： H05K5/04

摘要： An electronic device housing and an electronic device including the same are provided. An electronic device housing includes a metal substrate, a plastic injection part formed on one area on a surface of the metal substrate, an oxide film layer formed on one area on the surface of the metal substrate, a plating layer formed on one area on the surface of the metal substrate, and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be apart from each other.

公开(公告)号：US20230216942A1

公开(公告)日：2023-07-06

申请号：US18120021

申请日：2023-03-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Junghyun IM ,  Joungki PARK ,  Jinwoo PARK ,  Seungchang BAEK ,  Yoonhee LEE ,  Jungwoo CHOI ,  Sungho CHO ,  Hangyu HWANG ,  Jongchul CHOI

IPC分类号： H04M1/02

CPC分类号： H04M1/0249 ,  H04M1/0274 ,  H04M1/0277

摘要： An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

公开(公告)号：US20220302952A1

公开(公告)日：2022-09-22

申请号：US17716629

申请日：2022-04-08

申请人： Samsung Electronics Co., Ltd.

发明人： Seungchang BAEK ,  Hyeongsam SON ,  Changhyeok SHIN ,  Junghyun IM ,  Jinwoo PARK ,  Jinhwan JEONG ,  Sungho CHO ,  Minwoo YOO

IPC分类号： H04B1/525 ,  H04B1/3827 ,  H04M1/02

摘要： A mobile electronic device is provided. The mobile electronic device includes a first component, a second component, a first space arranged to accommodate the first component, a second space arranged adjacent to the first space to accommodate the second component and communicate with outside of the mobile electronic device in a first direction, and having a side opened in a second direction perpendicular to the first direction, a housing comprising an isolation part for isolating the first space and the second space, and a sealing member arranged on the opened side of the second space. The isolation part includes a first isolation part formed of a metal material and a second isolation part coupled to the first isolation part and formed of an injection material.

公开(公告)号：US20220248551A1

公开(公告)日：2022-08-04

申请号：US17590039

申请日：2022-02-01

申请人： Samsung Electronics Co., Ltd.

发明人： Yoonhee LEE ,  Hangyu HWANG ,  Junghyun IM

IPC分类号： H05K5/02 ,  H01Q1/24 ,  H04M1/02 ,  G06F1/16

摘要： Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.

公开(公告)号：US20210329799A1

公开(公告)日：2021-10-21

申请号：US17301845

申请日：2021-04-15

申请人： Samsung Electronics Co., Ltd.

发明人： Junghyun IM ,  Hyosang LIM ,  Heekwang LIM ,  Seungchang BAEK ,  Hyeongsam SON ,  Sungho CHO ,  Hangyu HWANG ,  Jongchul CHOI

IPC分类号： H05K5/02 ,  H05K5/00

摘要： An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.