公开(公告)号：US20220130709A1

公开(公告)日：2022-04-28

申请号：US17330940

申请日：2021-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-San JUNG ,  Hyunseok CHOI ,  Jun-Su LIM

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/687 ,  H01L21/67

Abstract: A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.