公开(公告)号：US20220130709A1

公开(公告)日：2022-04-28

申请号：US17330940

申请日：2021-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-San JUNG ,  Hyunseok CHOI ,  Jun-Su LIM

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/687 ,  H01L21/67

Abstract: A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.

公开(公告)号：US20140334108A1

公开(公告)日：2014-11-13

申请号：US14340242

申请日：2014-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-San JUNG ,  Joo-Han LEE ,  Jung-Chan CHO ,  Hyun-Seok CHOI

IPC: H05K3/10 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K3/10 ,  H05K1/0353 ,  H05K1/112 ,  H05K3/3452 ,  H05K2201/09581 ,  H05K2201/09909 ,  Y10T29/49155

Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.

Abstract translation: 提供了包括自组装有机分子层的半导体封装模块和制造半导体封装模块的方法。 半导体封装模块可以包括具有多个金属线图案和形成在其上的多个安装焊盘的模块印刷电路板（PCB）。 半导体封装还可以包括在从多个金属线图案中选择的至少一种金属线图案上自组装的绝缘薄膜。 为了制造半导体封装模块，绝缘薄膜形成为在模块PCB上形成多个金属线图案，其中形成多个通孔，然后将有机化合物自组装在 从所述多个金属线图案中选择的至少一个金属线图案的表面。