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公开(公告)号：US10461411B2
公开(公告)日：2019-10-29
申请号：US15008730
申请日：2016-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungbum Choi , Juneseok Park , Sunghyun Kim
Abstract: An electronic device may include thin antennas disposed proximate a rear or front surface. An antenna structure may be disposed at a portion of a first surface or a second surface of a non-metal structure within the device, and is electrically connected to the metal structure. The antenna structure may comprise: a first bonding layer attached to a portion of the first surface or the second surface, where an opening is formed in the first bonding layer at a location of the metal structure; a antenna element pattern arranged on the first bonding layer and electrically connected to the metal structure through the opening; a second bonding layer arranged on the antenna element pattern; and an insulation layer arranged on the second bonding layer.
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公开(公告)号：US09799975B2
公开(公告)日：2017-10-24
申请号：US15164198
申请日：2016-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok Park
CPC classification number: H01R12/79 , H01R12/714 , H01R12/771 , H01R13/24 , H01R13/6205 , H05K3/325 , H05K2201/0311 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/104 , Y02P70/611
Abstract: An electronic device may include: a printed circuit board (PCB); a plurality of electronic components electrically connected to the PCB; and a connection member comprising a first portion fixed to one of the PCB and an electronic component and a second portion magnetically connected to the other one of the PCB and the electronic component. The second portion of the connection member may be moveably connected to the first portion. The connection member may further include a stopper, and may be designed to minimize the repulsive force provided by the connection member when excessive pressure is applied to the electronic device.
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