公开(公告)号：US20230016260A1

公开(公告)日：2023-01-19

申请号：US17864584

申请日：2022-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Manho HAN ,  Junggil KIM ,  Hogon PARK ,  Seunggil JEON ,  Woosik CHO ,  Sukgi HONG

IPC: G01S13/02 ,  G01S13/72 ,  H04B17/318

Abstract: An embodiment of the disclosure provides an apparatus that include a communication module, a memory, a processor operatively connected to at least one of the communication module or the memory. The processor may be configured to perform UWB communication with a plurality of anchors included in a vehicle via the communication module according to a first scheme, to determine whether a distance to the vehicle falls within a predetermined distance by measuring the distance via the UWB communication, to determine whether a predetermined condition is satisfied if the distance falls within the predetermined distance, and if the predetermined condition is satisfied, to change the UWB communication scheme from the first scheme to a second scheme. Other embodiments are possible.

公开(公告)号：US20240073307A1

公开(公告)日：2024-02-29

申请号：US18387351

申请日：2023-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bumhee BAE ,  Kiman KIM ,  Junggil KIM ,  Younghun SEONG ,  Jeongnam CHEON

IPC: H04M1/02 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04M1/0277 ,  H04M1/0216 ,  H04M1/0274 ,  H05K1/0253 ,  H05K1/189

Abstract: A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

公开(公告)号：US20220131276A1

公开(公告)日：2022-04-28

申请号：US17569132

申请日：2022-01-05

Applicant: Samsung Electronics Co., Ltd. ,  Industry-Academic Cooperation Foundation, Yonsei University

Inventor： Junggil KIM ,  Youngjoong YOON ,  Sungsoo KIM ,  Sunghoe KIM ,  Janghwan BAE

IPC: H01Q21/06 ,  H04M1/02

Abstract: Electronic device is provided. The electronic device comprises: a housing surrounding a space between first and second plates and including a side surface member of which at least a portion includes a conductive section; a communication module; and an antenna structure. The conductive section includes first and second regions formed at a different position. The antenna structure includes a plurality of first slot sets formed in the first region, wherein at least two first slots extending in a first direction combine to form one first slot set and the plurality of first slot sets are formed at first designated intervals in a second direction, and a plurality of second slot sets formed in the second region. At least two second slots extending in the first direction combine to form one second slot set and the plurality of second slot sets are formed at second designated intervals in the second direction.