公开(公告)号：US20220287180A1

公开(公告)日：2022-09-08

申请号：US17554217

申请日：2021-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunmo YANG ,  Junwhon UHM ,  Jungkeun LEE ,  Yonghyun PARK ,  Junmyeong JEONG ,  Myeongjae HONG

IPC: H05K1/14 ,  H05K5/02 ,  H05K1/02

Abstract: An electronic device includes a frame, a housing including a first temple connected to one side of the frame and a second temple connected to an opposite side of the frame, a first printed circuit board (PCB) located in the first temple, a first flexible printed circuit board (FPCB) electrically connected to the first PCB, and a second FPCB electrically connected to the first PCB. The first FPCB includes a first overlapping portion that is extracted from the first PCB in a first direction and overlaps the second FPCB. The first FPCB further includes a first branch that extends from the first overlapping portion and does not overlap the second FPCB. The second FPCB includes a second overlapping portion that is extracted from the first PCB in the first direction and overlaps the first FPCB. The second FPCB further includes a second branch that extends from the second overlapping portion and does not overlap the first FPCB.

公开(公告)号：US20230283090A1

公开(公告)日：2023-09-07

申请号：US18195503

申请日：2023-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin YOON ,  Sungkwang YANG ,  Jungkeun LEE

IPC: H02J7/00 ,  G06F1/20 ,  G06F1/16 ,  H01M10/63 ,  H01M10/623

CPC classification number: H02J7/0044 ,  G06F1/203 ,  G06F1/1628 ,  H01M10/63 ,  H01M10/623 ,  G06F1/163 ,  H10N10/10

Abstract: A case device for presenting a charging function of various embodiments of the present disclosure may include a housing including an internal space for accommodating a wearable device, a communication interface for presenting a wired or wireless connection with the wearable device, at least one accommodating groove formed in the internal space for accommodating the wearable device, at least one thermoelectric module disposed to be partially exposed through the at least one accommodating groove, a heat radiating member disposed adjacent to the at least one thermoelectric module, a battery disposed inside the housing, and at least one processor electrically connected to the communication interface, the at least one thermoelectric module, the heat radiating member, and the battery. The at least one processor may acquire state information of the wearable device, and control the at least one thermoelectric module, based on the state information of the wearable device.

公开(公告)号：US20220346277A1

公开(公告)日：2022-10-27

申请号：US17422612

申请日：2021-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho YOON ,  Yonghyun PARK ,  Jungkeun LEE ,  Sangchul JUNG ,  Chunsik CHOI

IPC: H05K7/20 ,  G02B27/01

Abstract: A wearable electronic device according to various embodiments of the disclosure includes: a housing including a first housing part in which a processor is received and a second housing part in which a display is received, and a hinge connecting the first housing part and the second housing part and having a hole provided in an area in communication with an outside of the wearable electronic device. At least part of heat generated from the processor is radiated to the outside through the hinge having the hole formed therein.

公开(公告)号：US20220210922A1

公开(公告)日：2022-06-30

申请号：US17537295

申请日：2021-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junwhon UHM ,  Jungkeun LEE ,  Hyunmo YANG ,  Seungnyun KIM ,  Yongsang YUN

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: An electronic device according to an embodiment includes: a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first printed circuit board (PCB) positioned in the first temple, and a flexible printed circuit board electrically connected to the first PCB, and the flexible printed circuit board includes a first rigid portion connected to the first PCB, a first flexible portion extending from the first rigid portion in a first direction, and a second flexible portion extending from the first rigid portion in a second direction different from the first direction, the second flexible portion being bent in a first bending area to overlap at least a portion of the first flexible portion.

公开(公告)号：US20220163809A1

公开(公告)日：2022-05-26

申请号：US17533209

申请日：2021-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungkeun LEE ,  Youngho YOON ,  Kyeongsoo KIM ,  Hyunmo YANG ,  Younsang YOO ,  Haejin LEE ,  Sangchul JUNG ,  Seungnyun KIM

IPC: G02B27/01 ,  H05K7/20

Abstract: A wearable electronic device is disclosed, including: a housing including a first surface facing a same direction as a gaze of a user, a second surface facing in a second direction towards a face of the user, and a side surface surrounding a space defined between the two surfaces, a first and second light output device disposed in the housing and configured to output an image, a printed circuit board at least partially disposed between the first and second light output device, and including at least one electronic component, a supportive frame, a battery disposed between the frame and the second surface, and a first heat radiating member disposed between the frame and the battery.

公开(公告)号：US20230059234A1

公开(公告)日：2023-02-23

申请号：US17980721

申请日：2022-11-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungkeun LEE ,  Chunsik CHOI ,  Yonghee JEUNG

IPC: G06F1/20 ,  G06F1/16 ,  G02B27/01

Abstract: According to an embodiment disclosed in the present document, an electronic device may include: a lens frame at least partially including a thermally conductive material; a pair of wearable members which can be rotatably coupled to the lens frame; at least one lens disposed in the lens frame; and transparent conductive lines disposed on the lens. The transparent conductive lines may be connected to the thermally conductive material of the lens frame to receive heat transferred from the lens frame. Other various embodiments are possible.

公开(公告)号：US20220210905A1

公开(公告)日：2022-06-30

申请号：US17572468

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chunsik CHOI ,  Jeongwon PARK ,  Youngho YOON ,  Jongmin YOON ,  Jungkeun LEE ,  Sangchul JUNG

IPC: H05K1/02 ,  H05K1/14 ,  G02B27/01 ,  G02C11/00

Abstract: In an electronic device includes a heat dissipation structure. The heat dissipation structure may include: a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board to form a space; a first interposer and a second interposer together surrounding the space; at least one electronic component disposed in the space and mounted on the first printed circuit board; a first thermal interface material (TIM) combined with the electronic component; and a heat dissipation body attached to the TIM and transferring heat of the electronic component to an outside of the space.