公开(公告)号：US20240399538A1

公开(公告)日：2024-12-05

申请号：US18583285

申请日：2024-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonmin YUN ,  Hyuntae LEE ,  Youngho JUNG ,  Keon-Woo KIM ,  Sung Yong PARK ,  Junyoung CHOI ,  Hoseop CHOI

IPC: B24B53/017

Abstract: A pad conditioner comprising: a disk holder that is rotatable; a frame on the disk holder; a lifting and lowering support member that is between the frame and the disk holder; a posture adjusting member that is between the lifting and lowering support member and the frame and has a thickness, wherein the posture adjusting member is capable of varying the thickness; a posture sensor that is configured to detect a height of the lifting and lowering support member; and a controller that is configured to vary the thickness of the posture adjusting member according to a signal received from the posture sensor.

公开(公告)号：US20230052061A1

公开(公告)日：2023-02-16

申请号：US17696277

申请日：2022-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyojin PARK ,  Songyun KANG ,  Sung Yong PARK ,  Keon-Woo KIM

IPC: B24B49/18 ,  B24B37/30 ,  B24B37/04 ,  B24B53/017

Abstract: Disclosed is a substrate polishing method comprising placing a substrate into a substrate polishing apparatus, rotating each of the substrate and a polishing pad of the substrate polishing apparatus, allowing a bottom surface of the substrate to contact a top surface of the polishing pad, and determining whether the polishing pad would benefit from maintenance. The polishing pad includes a plurality of annular regions that are homocentric with a central point of the top surface of the polishing pad. The step of determining whether the polishing pad would benefit from maintenance includes ascertaining a state of the bottom surface of the substrate, and selecting one of the plurality of annular regions by using information about the state of the bottom surface of the substrate. The one of the plurality of annular regions would benefit from maintenance.