Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics
    1.
    发明申请
    Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics 有权
    具有改善的漏电流特性的制造具有半导体器件的电容器的方法

    公开(公告)号:US20030036239A1

    公开(公告)日:2003-02-20

    申请号:US10034043

    申请日:2001-12-20

    CPC classification number: H01L28/55

    Abstract: A method for manufacturing a capacitor of a semiconductor device is provided. The method includes the steps of: forming a first electrode on a semiconductor substrate; forming a dielectric layer on the first electrode; forming a second electrode on the dielectric layer; first annealing the capacitor having the first electrode, the dielectric layer, and the second electrode under oxygen atmosphere; and second annealing the capacitor having the first electrode, the dielectric layer, and the second electrode under vacuum.

    Abstract translation: 提供一种用于制造半导体器件的电容器的方法。 该方法包括以下步骤:在半导体衬底上形成第一电极; 在所述第一电极上形成介电层; 在所述电介质层上形成第二电极; 在氧气氛下首先退火具有第一电极,电介质层和第二电极的电容器; 以及在真空下对具有第一电极,电介质层和第二电极的电容器进行第二次退火。

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