公开(公告)号：US20190189593A1

公开(公告)日：2019-06-20

申请号：US16135122

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Hyung KIM ,  Sung-Hyup KIM ,  Kyeong-Bin LIM ,  Seok-Ho KIM ,  Tae-Yeong KIM

IPC: H01L25/065 ,  H01L21/67 ,  H01L21/687 ,  H01L21/66 ,  H01L25/00

Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.