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1.发明申请公开(公告)号：US20180262255A1
公开(公告)日：2018-09-13
申请号：US15763002
申请日：2016-09-23
Inventor： Inkyu LEE , Jong-Ho OH , Bong-Jin KIM , Tae-Yeong KIM , Min-Ki AHN , Tae-Seok OH , Seok-Ju JANG
IPC: H04B7/06 , H04B7/08 , H04B7/0491
CPC classification number: H04B7/0695 , H04B7/0491 , H04B7/0617 , H04B7/088
Abstract: The present invention relates to a 5th-generation (5G) or pre-5G communication system which is provided for supporting a higher data transfer rate after a 4th-generation (4G) communication system such as a long term evolution (LTE). The present invention provides a method for selecting, by an access point (AP), a beam in a communication system supporting a beamforming scheme, the method comprising: a step of transmitting information which indicates whether or not a duplicated beacon transmission interval (BTI) is operated; and a step of performing a transmit sector sweep (TXSS) process at least twice during the duplicated BTI.
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公开(公告)号：US20190189593A1
公开(公告)日：2019-06-20
申请号：US16135122
申请日：2018-09-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun-Hyung KIM , Sung-Hyup KIM , Kyeong-Bin LIM , Seok-Ho KIM , Tae-Yeong KIM
IPC: H01L25/065 , H01L21/67 , H01L21/687 , H01L21/66 , H01L25/00
Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.
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