公开(公告)号：US20180003520A1

公开(公告)日：2018-01-04

申请号：US15705670

申请日：2017-09-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyoung CHUNG ,  Jeongmin PARK ,  Donghwan BAE ,  Jungwon SUH ,  Cheoljun LEE ,  Jeongho CHO ,  Kyonggon CHOI ,  Jiwoong OH

IPC: G01C25/00

CPC classification number: G01C25/00 ,  F25D29/005 ,  G06F3/01 ,  H04L12/2803 ,  H04L12/4625 ,  H04L67/12 ,  H04L67/16 ,  H04M2250/12 ,  H04W4/24

Abstract: An electronic device and method utilizes an external sensor group to facilitate miniaturization the device and repair/replacement of external sensors. An interface connected to an external sensor package including at least one sensor. A processor that when the external sensor package is connected through the interface, determines from which group the external sensor package is included in among pre-configured groups and controls the performance of a function corresponding to the determined group.

公开(公告)号：US20210392613A1

公开(公告)日：2021-12-16

申请号：US17286975

申请日：2019-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungjung JOO ,  Jongho KIM ,  Kyonggon CHOI ,  Yunwoo LEE ,  Seongmin JE

IPC: H04W64/00 ,  G01S19/43

Abstract: According to various embodiments, an electronic device comprises: a housing; a touchscreen display viewed through a part of the housing; at least one communication module located inside the housing; a processor located inside the housing and operationally connected to the display and the at least one communication module; and a memory located inside the housing and operationally connected to the processor, wherein the memory is provided to store a location measurement map, and can store instructions allowing, when executed, the processor to check the location of the electronic device by using the communication module, determine a block corresponding to the location of the electronic device on the location measurement map on the basis of at least a portion of the checked location of the electronic device, determine the location measurement method on the basis of at least a portion of priority information about a position source for the determined block and position source information about the electronic device, and measure the final location of the electronic device by means of the determined location measurement method by using the communication module. Other embodiments are possible.

公开(公告)号：US20170048797A1

公开(公告)日：2017-02-16

申请号：US15203936

申请日：2016-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyonggon CHOI ,  Joonhwan LEE

IPC: H04W52/02 ,  G01S19/13 ,  H04W4/02

CPC classification number: H04W52/0229 ,  G01S19/13 ,  H04W4/027 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/166 ,  Y02D70/168 ,  Y02D70/26

Abstract: An electronic device and method for identifying location information are provided. The electronic device may include a receiver circuit for receiving location-related information from external devices, and a controller. The controller may implement the method, including controlling the receiver circuit to obtain the location related information from the external devices, determining the location of the electronic device based on the received location information, and deactivating the receiver circuit based on the determination result.

Abstract translation: 提供了一种用于识别位置信息的电子设备和方法。 电子设备可以包括用于从外部设备接收位置相关信息的接收机电路和控制器。 控制器可以实现该方法，包括控制接收机电路以从外部设备获得位置相关信息，基于接收的位置信息确定电子设备的位置，以及基于确定结果去激活接收机电路。

公开(公告)号：US20160124498A1

公开(公告)日：2016-05-05

申请号：US14924004

申请日：2015-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyoung CHUNG ,  Jeongmin PARK ,  Donghwan BAE ,  Jungwon SUH ,  Cheoljun LEE ,  Jeongho CHO ,  Kyonggon CHOI ,  Jiwoong OH

IPC: G06F3/01 ,  G06F3/0484 ,  G06F3/0481 ,  G06F3/0346

CPC classification number: G01C25/00 ,  F25D29/005 ,  G06F3/01 ,  H04L12/2803 ,  H04L12/4625 ,  H04L67/12 ,  H04L67/16 ,  H04M2250/12 ,  H04W4/24

Abstract: An electronic device and method utilizes an external sensor group to facilitate miniaturization the device and repair/replacement of external sensors. An interface connected to an external sensor package including at least one sensor. A processor that when the external sensor package is connected through the interface, determines from which group the external sensor package is included in among pre-configured groups and controls the performance of a function corresponding to the determined group.

Abstract translation: 电子设备和方法利用外部传感器组来实现设备的小型化和外部传感器的修理/更换。 连接到包括至少一个传感器的外部传感器封装的接口。 当通过接口连接外部传感器封装的处理器，确定预组态组中包含外部传感器封装的组，并且控制与所确定的组相对应的功能的性能。