公开(公告)号：US11508713B2

公开(公告)日：2022-11-22

申请号：US17168706

申请日：2021-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Oh ,  Kyonghwan Koh ,  Sangsoo Kim ,  Seunghwan Kim ,  Jongho Park ,  Yongkwan Lee

IPC: H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/78 ,  H01L25/065

Abstract: A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.

公开(公告)号：US20210242190A1

公开(公告)日：2021-08-05

申请号：US17168706

申请日：2021-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Oh ,  Kyonghwan Koh ,  Sangsoo Kim ,  Seunghwan Kim ,  Jongho Park ,  Yongkwan Lee

IPC: H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.