公开(公告)号：US20160318293A1

公开(公告)日：2016-11-03

申请号：US15139996

申请日：2016-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Do Hyung KIM ,  Dong-Hee HAN ,  Do-Wan KIM ,  Byeong-Cheol KIM ,  Hak Rae KIM ,  Jung Hun SUNG ,  Sung-Gwan WOO ,  Kyung Woon JANG ,  Chang Kyu CHUNG ,  Kyoung Hern HONG ,  Sung-Ju HWANG

IPC: B32B37/14 ,  B32B37/12

CPC classification number: B32B38/1866 ,  B32B37/12 ,  B32B38/1841 ,  B32B2309/68 ,  B32B2457/20 ,  G02F1/1303 ,  Y10T156/1002 ,  Y10T156/1028

Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.

Abstract translation: 本文公开了一种层压装置，其将基板粘附到具有弯曲表面的盖窗口和使用其的层压方法。 层压装置包括：第一夹具，其上安装有盖窗，其中在所述盖窗中形成弯曲表面部分，并且其曲率中心位于所述弯曲表面部分的后面;第二夹具，其上安置有引导构件， 其中，基板被安装在所述引导构件上，并且所述引导构件具有大于所述基板的宽度的宽度，以及设置成干涉所述引导构件的两个相对的前表面的干涉构件，其中所述干涉构件干涉所述引导构件， 当第二夹具接近第一夹具时，引导构件弯曲。

公开(公告)号：US20200235078A1

公开(公告)日：2020-07-23

申请号：US16650578

申请日：2018-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Woon JANG ,  Hyun-Tae JANG ,  Youngjun MOON ,  Changjoon LEE

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/24 ,  H01L27/12

Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.

公开(公告)号：US20160350572A1

公开(公告)日：2016-12-01

申请号：US15114982

申请日：2014-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il KIM ,  Young Jun MOON ,  Tae Sang PARK ,  Kyung Woon JANG ,  Seung Hee OH ,  Chang Kyu CHUNG ,  Dong Yul LEE

IPC: G06K9/00

CPC classification number: G06K9/0002 ,  G06F1/169 ,  G06F3/03547 ,  G06F2203/0338 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192

Abstract: Disclosed are fingerprint recognition device having an improved structure to enable a driving device of an integrated circuit to have durability, a manufacturing method therefor, and an electronic device. The fingerprint recognition device comprise: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

Abstract translation: 公开了一种具有改进的结构以使集成电路的驱动装置具有耐久性的指纹识别装置，其制造方法和电子装置。 指纹识别装置包括：电连接到至少一个传感器电极的集成电路; 位于所述集成电路的上部并设置有所述至少一个传感器电极的第一电路板; 电连接到第一电路板并位于集成电路下方的第二电路板; 设置在第一电路板下方以围绕集成电路以便将集成电路从外部保护的模制层; 以及电连接第一电路板和第二电路板的连接部。