公开(公告)号：US20200219912A1

公开(公告)日：2020-07-09

申请号：US16701750

申请日：2019-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： IN HO RO ,  DOOWON KWON ,  SEOKJIN KWON ,  JAMEYUNG KIM ,  JINYOUNG KIM ,  SUNGKI MIN ,  KWANSIK CHO ,  MANGEUN CHO ,  HO-CHUL JI

IPC: H01L27/146

Abstract: An image sensor including a semiconductor substrate having a first surface and a second surface, and a pixel region having a photoelectric conversion region; a first conductive pattern in a first trench defining the pixel region and extending from the first surface toward the second surface; a second conductive pattern in a second trench shallower than the first trench and defined between a plurality of active patterns on the first surface of the pixel region; a transfer transistor and a plurality of logic transistors on the active patterns; and a conductive line on the second surface and electrically connected to the first conductive pattern.

公开(公告)号：US20210335862A1

公开(公告)日：2021-10-28

申请号：US17099880

申请日：2020-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： KANGHUN LEE ,  SEUNGJOO NAH ,  HEEGEUN JEONG ,  MANGEUN CHO

IPC: H01L27/146

Abstract: Disclosed is an image sensor comprising a substrate that has a first surface and a second surface that face each other, an isolation pattern that defines a plurality of pixel regions in the substrate, a plurality of contact plugs on the first surface of the substrate and coupled to the isolation pattern, and a plurality of first micro-lens patterns on the second surface of the substrate. The contact plugs include a first contact plug and a second contact plug that neighbor each other. A portion of the isolation pattern extends to run across a first region and a second region in the substrate. The first region vertically overlaps the first contact plug. The second region vertically overlaps the second contact plug.