CMOS IMAGE SENSOR
    2.
    发明申请
    CMOS IMAGE SENSOR 有权
    CMOS图像传感器

    公开(公告)号:US20150001663A1

    公开(公告)日:2015-01-01

    申请号:US14315730

    申请日:2014-06-26

    CPC classification number: H01L27/14621 H01L27/14627 H01L27/1463 H01L27/1464

    Abstract: An image sensor includes a semiconductor substrate, a storage node region in the semiconductor substrate, an insulating portion on the semiconductor substrate, a via contact extending through the insulating portion, a photo-electric converter in the semiconductor substrate and spaced apart from the storage node region, an organic photo-electric layer on the insulating portion, and a buffer interposed between and electrically connecting the via contact and the storage node region.

    Abstract translation: 图像传感器包括半导体衬底,半导体衬底中的存储节点区域,半导体衬底上的绝缘部分,延伸穿过绝缘部分的通孔接触,半导体衬底中的光电转换器,并与存储节点间隔开 区域,绝缘部分上的有机光电层,以及插入在电触点和存储节点区域之间并将其电连接的缓冲器。

    IMAGE SENSORS WITH MULTIPLE FUNCTIONS AND IMAGE SENSOR MODULES INCLUDING THE SAME

    公开(公告)号:US20210075985A1

    公开(公告)日:2021-03-11

    申请号:US16950122

    申请日:2020-11-17

    Abstract: An image sensor includes a first sensor pixel and a second sensor pixel that vertically overlap each other. The first sensor pixel includes a first signal generation circuit, and a first photoelectric converter that is connected to the first signal generation circuit and configured to generate first information from light having a first wavelength. The second sensor pixel includes a second signal generation circuit, and a second photoelectric converter that is connected to the second signal generation circuit and configured to generate second information from light having a second wavelength. A first horizontal surface area of the first photoelectric converter is different from a second horizontal surface area of the second photoelectric converter. An image sensor module includes the image sensor, a light source configured to emit light to a target object, and a dual band pass filter configured to selectively pass light reflected from the target object.

    IMAGE SENSOR, METHOD FOR MANUFACTURING THE SAME, AND IMAGE PROCESSING DEVICE HAVING THE IMAGE SENSOR
    4.
    发明申请
    IMAGE SENSOR, METHOD FOR MANUFACTURING THE SAME, AND IMAGE PROCESSING DEVICE HAVING THE IMAGE SENSOR 审中-公开
    图像传感器,其制造方法和具有图像传感器的图像处理装置

    公开(公告)号:US20160351630A1

    公开(公告)日:2016-12-01

    申请号:US15233383

    申请日:2016-08-10

    Abstract: An image sensor comprising: a first layer having a plurality of groups of photodiodes formed in a semiconductor substrate, each group representing a 2×2 array of photodiodes, with 2 first pixels configured to detect light of a first wavelength and 2 second pixels configured to detect light of a second wavelength, each first pixel positioned adjacent to the second pixels; and a second layer overlapping the first layer, the second layer is organic, having a plurality of organic photodiodes configured to detect light of a third wavelength, each organic photodiode positioned to partially overlap 2 first photodiodes and 2 second photodiodes of the first layer.

    Abstract translation: 一种图像传感器,包括:第一层,其具有形成在半导体衬底中的多组光电二极管,每个组表示2×2的光电二极管阵列,其中2个第一像素被配置为检测第一波长的光和2秒的像素, 检测第二波长的光,每个第一像素定位成与第二像素相邻; 以及与所述第一层重叠的第二层,所述第二层是有机的,具有被配置为检测第三波长的光的多个有机光电二极管,每个有机光电二极管定位成部分地重叠第一层的2个第一光电二极管和2个第二光电二极管。

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