公开(公告)号：US20240203943A1

公开(公告)日：2024-06-20

申请号：US18346921

申请日：2023-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyoung KIM ,  Jiwon KIM ,  Minyong LEE ,  Dohyung KIM ,  Sukkang SUNG

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/528 ,  H10B80/00

CPC classification number: H01L25/0657 ,  H01L23/528 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/80379 ,  H01L2225/0651 ,  H01L2225/06562

Abstract: The inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical direction.