公开(公告)号：US12126095B2

公开(公告)日：2024-10-22

申请号：US17971165

申请日：2022-10-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyihyun Jang ,  Jiho Kim ,  Seongyong An ,  Moohyun Roh ,  Gyubok Park ,  Kyungmoon Seol ,  Jaewon Choe

IPC: H01Q5/314 ,  H01Q1/24 ,  H01Q1/38 ,  H04B7/0413

CPC classification number: H01Q5/314 ,  H01Q1/243 ,  H01Q1/38 ,  H04B7/0413

Abstract: An electronic device includes: a side member forming sides of the electronic device, the side member including a first conductive portion, a second conductive portion, a first non-conductive portion, and a slit; a printed circuit board including the ground; and a wireless communication circuit, wherein the first conductive portion includes a first electrical path and a second electrical path, the second conductive portion includes a third electrical path and a fourth electrical path, a capacitor is arranged along the third electrical path, and the wireless communication circuit may feed, to the first conductive portion via the first electrical path, an RF signal of a first frequency band and may feed, to the second conductive portion via the third electrical path, an RF signal of a second frequency band which at least partially overlaps the first frequency band.

公开(公告)号：US12218439B2

公开(公告)日：2025-02-04

申请号：US17863996

申请日：2022-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jiho Kim ,  Moohyun Roh ,  Gyubok Park ,  Kyungmoon Seol ,  Seongyong An ,  Kyihyun Jang ,  Jaewon Choe

IPC: H01Q5/328 ,  H01Q5/335 ,  H01Q5/50

Abstract: An electronic device is provided. The electronic device includes a housing including a conductive member on which at least one power supply point and ground point are positioned, at least one ground member arranged inside the housing, a first ground path connecting the ground point to the ground member, a second ground path connecting the ground point to the ground member, a printed circuit board (PCB) arranged inside the housing and a processor arranged on the PCB. The processor is configured to supply power to the at least one power supply point so that the conductive member transmits and/or receives a signal of a first frequency band.

公开(公告)号：US11316266B2

公开(公告)日：2022-04-26

申请号：US17106778

申请日：2020-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewon Choe ,  Jiho Kim ,  Moohyun Roh ,  Gyubok Park ,  Kyungmoon Seol ,  Seongyong An ,  Kyihyun Jang

IPC: H01Q1/52 ,  H01Q1/24 ,  H04M1/02

Abstract: An electronic device for minimizing parasitic emission is provided. The electronic device includes a housing including a front cover, a rear cover located on the opposite side of the front cover, and a lateral member surrounding a space between the front cover and the rear cover, the lateral member having a first conductive portion formed on at least a portion thereof, a support member disposed in the space of the housing and including a second conductive portion having therein at least one opening, a display including a conductive sheet that is disposed between the front cover and the support member so as to be visible from an outside through at least a part of the front cover and is disposed to face the support member, and a wireless communication circuit electrically connected to the first conductive portion. The conductive sheet includes a first portion, a second portion disposed adjacent to the first portion, and a coupling that is partly connected between the first portion and the second portion. In case the front cover is viewed from above, the coupling is disposed at a position overlapping the opening.