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公开(公告)号：US11670559B2
公开(公告)日：2023-06-06
申请号：US17206295
申请日：2021-03-19
发明人： Minjung Choi , Jung-Hoon Han , Jiho Kim , Young-Yong Byun , Yeonjin Lee , Jihoon Chang
CPC分类号： H01L23/3171 , H01L23/3192 , H01L23/528 , H01L21/78 , H01L23/291 , H01L23/296 , H01L23/585 , H01L24/05 , H01L2224/0219 , H01L2224/0221 , H01L2224/02181 , H01L2224/05541 , H01L2224/05553
摘要： A semiconductor device including a substrate including a chip region and an edge region; integrated circuit elements on the chip region; an interlayer insulating layer covering the integrated circuit elements; an interconnection structure on the interlayer insulating layer and having a side surface on the edge region; a first and second conductive pattern on the interconnection structure, the first and second conductive patterns being electrically connected to the interconnection structure; a first passivation layer covering the first and second conductive patterns and the side surface of the interconnection structure; and a second passivation layer on the first passivation layer, wherein the second passivation layer includes an insulating material different from the first passivation layer, and, between the first and second conductive patterns, the second passivation layer has a bottom surface that is located at a vertical level lower than a top surface of the first conductive pattern.
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公开(公告)号：US11316266B2
公开(公告)日：2022-04-26
申请号：US17106778
申请日：2020-11-30
发明人： Jaewon Choe , Jiho Kim , Moohyun Roh , Gyubok Park , Kyungmoon Seol , Seongyong An , Kyihyun Jang
摘要： An electronic device for minimizing parasitic emission is provided. The electronic device includes a housing including a front cover, a rear cover located on the opposite side of the front cover, and a lateral member surrounding a space between the front cover and the rear cover, the lateral member having a first conductive portion formed on at least a portion thereof, a support member disposed in the space of the housing and including a second conductive portion having therein at least one opening, a display including a conductive sheet that is disposed between the front cover and the support member so as to be visible from an outside through at least a part of the front cover and is disposed to face the support member, and a wireless communication circuit electrically connected to the first conductive portion. The conductive sheet includes a first portion, a second portion disposed adjacent to the first portion, and a coupling that is partly connected between the first portion and the second portion. In case the front cover is viewed from above, the coupling is disposed at a position overlapping the opening.
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公开(公告)号：US11791184B2
公开(公告)日：2023-10-17
申请号：US17719722
申请日：2022-04-13
发明人： Jiho Kim , Minhyeok Kwon , Shigenobu Maeda , Jooyeok Seo , Minuk Lee
IPC分类号： H01L21/67 , G05B19/418
CPC分类号： H01L21/67276 , G05B19/41865 , G05B2219/32291 , G05B2219/33034 , G05B2219/45031
摘要： The program code, when executed by a processor, causes the processor to input fabrication data including a plurality of parameters associated with a semiconductor fabricating process to a framework to generate a first class for analyzing the fabrication data, to extract a first parameter targeted for analysis and a second parameter associated with the first parameter from the plurality of parameters and generate a second class for analyzing the first parameter as a sub class of the first class, to modify the first parameter and the second parameter into a data structure having a format appropriate to store in the second class, so as to be stored in the second class, to perform data analysis on the first parameter and the second parameter, to transform the first parameter and the second parameter into corresponding tensor data, and to input the tensor data to the machine learning model.
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公开(公告)号：US20240281323A1
公开(公告)日：2024-08-22
申请号：US18469894
申请日：2023-09-19
发明人： Myungkyu Lee , Seongmuk Kang , Jiho Kim , Kijun Lee , Kyomin Sohn
IPC分类号： G06F11/10
CPC分类号： G06F11/1044
摘要： A memory controller including a processor and configured to control a memory module including a plurality of data chips and at least one parity chip includes an error correction code (ECC) engine, the ECC engine including an ECC decoder to correct Q symbols errors in a codeword set read from the memory module, Q is a maximum natural number equal to or less than P and P is a natural number equal to or greater than four. The ECC decoder is configured to generate a syndrome including first through P-th syndrome symbols based on the read codeword set by using a parity check matrix and to perform a first ECC decoding to correct a single symbol error in the read codeword set based on the first syndrome symbol and a selected syndrome symbol corresponding to one of the second through P-th syndrome symbols.
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公开(公告)号：US20240178861A1
公开(公告)日：2024-05-30
申请号：US18339490
申请日：2023-06-22
发明人： Jiho Kim , Seongmuk Kang , Daehyun Kim , Kijun Lee , Myungkyu Lee , Kyomin Sohn , Sunghye Cho
CPC分类号： H03M13/1111 , H03M13/611
摘要： A memory controller to control a memory module including a plurality of data chips, a first parity chip and a second parity chip, includes a system error correction code (ECC) engine and a processor to control the system ECC engine. The system ECC engine includes an ECC decoder and a memory to store a parity check matrix. The ECC decoder selects one of a plurality of ECC decoding schemes based on decoding status flags and corrects a plurality of symbol errors in a read codeword set from the memory module by performing an ECC decoding on the read codeword set based on the selected decoding scheme and the parity check matrix. The decoding status flags are provided from the plurality of data chips and each of the decoding status flags indicates whether at least one error bit is detected in respective one of the plurality of data chips.
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公开(公告)号：US12126095B2
公开(公告)日：2024-10-22
申请号：US17971165
申请日：2022-10-21
发明人： Kyihyun Jang , Jiho Kim , Seongyong An , Moohyun Roh , Gyubok Park , Kyungmoon Seol , Jaewon Choe
IPC分类号： H01Q5/314 , H01Q1/24 , H01Q1/38 , H04B7/0413
CPC分类号： H01Q5/314 , H01Q1/243 , H01Q1/38 , H04B7/0413
摘要： An electronic device includes: a side member forming sides of the electronic device, the side member including a first conductive portion, a second conductive portion, a first non-conductive portion, and a slit; a printed circuit board including the ground; and a wireless communication circuit, wherein the first conductive portion includes a first electrical path and a second electrical path, the second conductive portion includes a third electrical path and a fourth electrical path, a capacitor is arranged along the third electrical path, and the wireless communication circuit may feed, to the first conductive portion via the first electrical path, an RF signal of a first frequency band and may feed, to the second conductive portion via the third electrical path, an RF signal of a second frequency band which at least partially overlaps the first frequency band.
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公开(公告)号：US11955699B2
公开(公告)日：2024-04-09
申请号：US17568128
申请日：2022-01-04
发明人： Mincheol Seo , Donghun Shin , Minkyung Lee , Jiho Kim , Sunghyup Lee , Kyihyun Jang , Huiwon Cho
CPC分类号： H01Q1/243 , H01Q9/0407
摘要： An electronic device is provided. The electronic device includes a housing including a side member, a support member, a display, an antenna module including one or more patch antennas, a printed circuit board (PCB), a wireless communication circuit disposed on the PCB, a first conductive member, a first connector, a second connector, and a protrusion extending from the first end of the first conductive member toward an interior of the housing, and electrically connected to the first conductive member. The antenna module is disposed at locations corresponding to a first opening defined by the first conductive member, the support member, the first connector, and the second connector, and a second opening defined by the first conductive member, the support member, the first connector, and the protrusion, and the wireless communication circuit is electrically connected to the protrusion and the antenna module.
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公开(公告)号：US11949149B2
公开(公告)日：2024-04-02
申请号：US17511910
申请日：2021-10-27
发明人： Seongyong An , Hyeonuk Kang , Jiho Kim , Kyungmoon Seol , Kyihyun Jang , Jaebong Chun
摘要： According to various embodiments, an electronic device includes: a first housing including a first area, a second housing coupled to be slidable in a first direction from the first housing and including a second area overlapping the first area in a slide-in state, an antenna structure disposed in the first housing to overlap the first area when the first housing is viewed from the top, a conductive part disposed in the second area and electromagnetically connected to the antenna structure in the slide-in state, and wireless communication circuitry electrically connected to the antenna structure. The wireless communication circuitry may be configured to transmit and/or receive radio signals in at least one designated frequency band through the antenna structure and the conductive part in the slide-in state.
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