公开(公告)号：US10707559B2

公开(公告)日：2020-07-07

申请号：US15899674

申请日：2018-02-20

申请人： Samsung Electronics Co., Ltd.

发明人： Moon Soo Son ,  Dong Ryul Shin ,  Hee Jun Lee ,  Byung Chan Jang ,  Hyun Jun Jeong

IPC分类号： H01Q1/24 ,  H01Q9/04 ,  H01Q5/371 ,  H01Q7/00 ,  H01Q1/48 ,  H01Q21/28 ,  H01Q9/42 ,  H01Q5/328 ,  H04M1/02 ,  H05K9/00 ,  H01Q9/30

摘要： Disclosed is an electronic device that includes a housing including a first plate, a second plate, and a side member, a ground layer, a display, a communication circuit, and a processor. The side member includes a first conductive part, a second conductive part, and a non-conductive part in contact with the first conductive part and the second conductive part and interposed between the first conductive part and the second conductive part. The first conductive part may be electrically coupled with the second conductive part. The ground layer may be electrically coupled with a partial section of the first conductive part that is adjacent to the second conductive part. The communication circuit may be electrically connected with the first conductive part and the second conductive part.