公开(公告)号：US20180370210A1

公开(公告)日：2018-12-27

申请号：US15845458

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-yeong Kim ,  Pil-kyu Kang ,  Seok-ho Kim ,  Kwang-jin Moon ,  Na-ein Lee ,  Ho-jin Lee

IPC: B32B37/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L23/00

Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.