公开(公告)号：US10971379B2

公开(公告)日：2021-04-06

申请号：US16276904

申请日：2019-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-hyung Kim ,  Sung-hyup Kim ,  Tae-yeong Kim

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/18 ,  H01L21/20 ,  B29C65/00 ,  B29C65/78 ,  B32B37/10

Abstract: A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

公开(公告)号：US09941243B2

公开(公告)日：2018-04-10

申请号：US15413824

申请日：2017-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-yeong Kim ,  Pil-kyu Kang ,  Seok-ho Kim ,  Kwang-jin Moon ,  Ho-jin Lee

IPC: H01L23/52 ,  H01L23/00

CPC classification number: H01L24/94 ,  H01L24/02 ,  H01L24/05 ,  H01L24/29 ,  H01L24/80 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/02215 ,  H01L2224/04105 ,  H01L2224/05147 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/8012 ,  H01L2224/8312 ,  H01L2224/83896 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/0537 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0549 ,  H01L2924/365 ,  H01L2224/80

Abstract: A wafer-to-wafer bonding structure includes a first wafer including a first conductive pad in a first insulating layer and a first barrier layer surrounding a lower surface and side surfaces of the first conductive pad, a second wafer including a second conductive pad in a second insulating layer and a second barrier layer surrounding a lower surface and side surfaces of the second conductive pad, the second insulating layer being bonded to the first insulating layer, and at least a portion of an upper surface of the second conductive pad being partially or entirely bonded to at least a portion of an upper surface of the first conductive pad, and a third barrier layer between portions of the first and second wafers where the first and second conductive pads are not bonded to each other.

公开(公告)号：US12051601B2

公开(公告)日：2024-07-30

申请号：US18119909

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-hyung Kim ,  Sung-hyup Kim ,  Tae-yeong Kim

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/673 ,  H01L21/687 ,  H01L23/00 ,  H01L25/00 ,  H01L27/146

CPC classification number: H01L21/67092 ,  H01L21/673 ,  H01L21/68735 ,  H01L22/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/80 ,  H01L25/50 ,  H01L27/1469 ,  H01L2221/683 ,  H01L2224/05 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

公开(公告)号：US12009231B2

公开(公告)日：2024-06-11

申请号：US18119909

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-hyung Kim ,  Sung-hyup Kim ,  Tae-yeong Kim

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/673 ,  H01L21/687 ,  H01L23/00 ,  H01L25/00 ,  H01L27/146

CPC classification number: H01L21/67092 ,  H01L21/673 ,  H01L21/68735 ,  H01L22/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/80 ,  H01L25/50 ,  H01L27/1469 ,  H01L2221/683 ,  H01L2224/05 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

公开(公告)号：US20180370210A1

公开(公告)日：2018-12-27

申请号：US15845458

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-yeong Kim ,  Pil-kyu Kang ,  Seok-ho Kim ,  Kwang-jin Moon ,  Na-ein Lee ,  Ho-jin Lee

IPC: B32B37/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L23/00

Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.

公开(公告)号：US09935037B2

公开(公告)日：2018-04-03

申请号：US15408977

申请日：2017-01-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Pil-kyu Kang ,  Ho-jin Lee ,  Byung-lyul Park ,  Tae-yeong Kim ,  Seok-ho Kim

IPC: H01L23/48 ,  H01L21/768 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/76879 ,  H01L21/76898 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/08146 ,  H01L2224/16146 ,  H01L2225/06548

Abstract: A multi-stacked device includes a lower device having a lower substrate, a first insulating layer on the lower substrate, and a through-silicon-via (TSV) pad on the first insulating layer, an intermediate device having an intermediate substrate, a second insulating layer on the intermediate substrate, and a first TSV bump on the second insulating layer, an upper device having an upper substrate, a third insulating layer on the upper substrate, a second TSV bump on the third insulating layer, and a TSV structure passing through the upper substrate, the third insulating layer, the second insulating layer, and the intermediate substrate to be connected to the first TSV bump, the second TSV bump, and the TSV pad. An insulating first TSV spacer between the intermediate substrate and the TSV structure and an insulating second TSV spacer between the upper substrate and the TSV structure are spaced apart along a stacking direction.

公开(公告)号：US09773660B2

公开(公告)日：2017-09-26

申请号：US14056270

申请日：2013-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-yeong Kim ,  Pil-kyu Kang ,  Byung-lyul Park ,  Jin-ho Park

IPC: H01L21/02 ,  H01L21/30 ,  H01L21/68 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/02016 ,  H01L21/304 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381

Abstract: Wafer processing methods are provided. The methods may include cutting respective edges of a wafer and an adhesive a predetermined angle before grinding a back surface of the wafer.