公开(公告)号：US20190188840A1

公开(公告)日：2019-06-20

申请号：US16032356

申请日：2018-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namyeong Kwon ,  Hyohyeong Kang ,  Yongdeok Kim

IPC: G06T7/00 ,  G06N3/08 ,  H01L21/66 ,  G01N21/95 ,  G01N21/956 ,  H01L21/67 ,  G06K9/62

Abstract: A semiconductor defect classification device includes feature extractors that are configured to receive images of semiconductor patterns on a wafer and to extract features of the images from the images, and a classifier that is configured to receive the features of the images and first meta information about the wafer and to use machine learning to classify a defect of the semiconductor patterns associated with the images based on the features of the images and the first meta information.

公开(公告)号：US11593657B2

公开(公告)日：2023-02-28

申请号：US16235500

申请日：2018-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Namyeong Kwon ,  Hayoung Joo

IPC: G06N3/08 ,  G06N20/00 ,  G06T7/00 ,  G06N3/04 ,  G06K9/62 ,  G06N3/084

Abstract: A machine learning method of a machine learning device including a machine learning classifier includes receiving, at the machine learning device, an image and first class information associated with the image, generating, at the machine learning device, second class information associated with the image by performing classification on the image by using the machine learning classifier, and as the second class information is generated, updating, at the machine learning device, the machine learning classifier by performing a first learning operation when a guide map is received together with the image and performing, at the machine learning device, a second learning operation different from the first learning operation when the guide map is not received together with the image.

公开(公告)号：US10713778B2

公开(公告)日：2020-07-14

申请号：US16032356

申请日：2018-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namyeong Kwon ,  Hyohyeong Kang ,  Yongdeok Kim

IPC: G06T7/00 ,  G06N3/08 ,  H01L21/66 ,  G01N21/95 ,  G06K9/62 ,  G01N21/956 ,  H01L21/67 ,  G01N21/88

Abstract: A semiconductor defect classification device includes feature extractors that are configured to receive images of semiconductor patterns on a wafer and to extract features of the images from the images, and a classifier that is configured to receive the features of the images and first meta information about the wafer and to use machine learning to classify a defect of the semiconductor patterns associated with the images based on the features of the images and the first meta information.