公开(公告)号：US20240021414A1

公开(公告)日：2024-01-18

申请号：US18141341

申请日：2023-04-28

申请人： Samsung Electronics Co., Ltd.

发明人： Suhwan Park ,  Ohchel Kwon ,  Yongmyung Jun ,  Gwanwoo Min ,  Hyeongkwon Jeong

IPC分类号： H01J37/32

CPC分类号： H01J37/32477 ,  H01J37/32522 ,  H01J37/3244 ,  H01J2237/334

摘要： A shock absorbing plate configured to absorb a shock between a first plate and a second plate stacked on the first plate in a vertical direction, positioned between the first plate and the second plate so that the first plate is apart from the second plate in the vertical direction, and having a circular shape when viewed in the vertical direction. When no pressure is applied to the shock absorbing plate, a vertical thickness of the shock absorbing plate is greatest at a center thereof and decreases from the center toward an outer edge thereof. A plurality of holes penetrate the shock absorbing plate in the vertical direction. A friction coefficient and an elastic modulus of the shock absorbing plate are less than a friction coefficient and an elastic modulus of each of the first plate and the second plate.