公开(公告)号：US09214484B2

公开(公告)日：2015-12-15

申请号：US14450864

申请日：2014-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ok-Gyeong Park ,  Min-Ok Na

IPC: H01L23/28 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/00011

Abstract: An image sensor package may include: a package substrate including a chip attachment area on an upper surface thereof, a pad area having a plurality of pads around the chip attachment area, and a holder attachment area at an outside of the pad area, wherein an upper surface of the holder attachment area is at a lower level than an upper surface of the pad area; an image sensor chip mounted on the chip attachment area of the package substrate; a transparent member above the package substrate and configured to cover the image sensor chip; and a holder on the holder attachment area of the package substrate and configured to fix the transparent member.

Abstract translation: 图像传感器封装可以包括：封装基板，其包括在其上表面上的芯片附接区域，具有围绕芯片附接区域的多个焊盘的焊盘区域以及焊盘区域的外部的保持器附接区域，其中 保持器附接区域的上表面处于比焊盘区域的上表面更低的水平面上; 安装在封装基板的芯片安装区域上的图像传感器芯片; 透明构件，其在所述封装基板上方并且被构造成覆盖所述图像传感器芯片; 以及在所述封装基板的所述保持器附着区域上的保持器，并且被配置为固定所述透明构件。

公开(公告)号：US09466632B2

公开(公告)日：2016-10-11

申请号：US14593500

申请日：2015-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ok-Gyeong Park

IPC: H01L27/14 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014

Abstract: Disclosed are an image sensor package and an image sensor module having the same. A diffusion resistor is provided on a circuit board for preventing liquid drop diffusion when the liquid drop is compressed. An image sensor chip is mounted on the circuit board such that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board. A bonding member is interposed between the circuit board and the image sensor chip around the diffusion resistor such that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip. Warpage characteristics of the image sensor package are improved by the diffusion resistor.

Abstract translation: 公开了一种图像传感器封装和具有该图像传感器封装的图像传感器模块。 扩散电阻器设置在电路板上，用于在液滴被压缩时防止液滴扩散。 图像传感器芯片安装在电路板上，使得图像传感器芯片的中心部分位于电路板的扩散电阻器上。 接合部件介于电路板和扩散电阻器周围的图像传感器芯片之间，使得图像传感器芯片的接合面积小于图像传感器芯片的接合面的表面积。 通过扩散电阻改善图像传感器封装的翘曲特性。