公开(公告)号：US20230384944A1

公开(公告)日：2023-11-30

申请号：US18135141

申请日：2023-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEUNGHAN LEE ,  SUNG CHUL HUR ,  BRIANMYUNGJUNE JUNG ,  SANG-HWA JIN

IPC: G06F3/06 ,  G06F1/30

CPC classification number: G06F3/0619 ,  G06F1/30 ,  G06F3/0652 ,  G06F3/0673

Abstract: A storage system includes a host, a back plane including a switching block and connected to the host, a plurality of storage sets connected to the back plane to receive power from the host, and a battery module connected to the back plane to supply spare power to at least one storage set of the plurality of storage sets through the switching block, when an abnormal power drop is detected in the at least one storage set of the plurality of storage sets. The battery module controls the at least one storage set to perform a data flushing operation, when power less than or equal to a threshold value is detected in the at least one storage set after supplying the spare power.

公开(公告)号：US20220174842A1

公开(公告)日：2022-06-02

申请号：US17665518

申请日：2022-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG CHUL HUR ,  DO IL KONG

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/18 ,  H05K1/02

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

公开(公告)号：US20200154606A1

公开(公告)日：2020-05-14

申请号：US16740593

申请日：2020-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG CHUL HUR ,  DO IL KONG

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/02 ,  H05K1/18

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.