公开(公告)号：US12287367B2

公开(公告)日：2025-04-29

申请号：US18303845

申请日：2023-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Il Kim ,  Joo Sung Yun ,  Ki Jae Song ,  Sang Do Han

IPC: G01R31/28 ,  G01R1/04

Abstract: A test board is provided. The test board comprises a first region which includes a first upper surface with first test sockets aligned thereon, and a first lower surface opposite to the first upper surface, a second region which includes a second upper surface with second test sockets aligned thereon, and a second lower surface opposite to the second upper surface, a hinge portion between the first region and the second region, and configured to connect the first region and the second region such that the first region and the second region are folded or unfolded, a first connector at one end of the first region opposite to the hinge portion and a second connector at one end of the second region opposite to the hinge portion.