专利检索 ap:("Samsung Electronics Co., Ltd.") AND inv:"Sang Hoon Han" 第 1 页

1.

发明申请
Wafer Support Assembly Including Ion Implantation Mask Structure 审中-公开

公开(公告)号：US20190051554A1

公开(公告)日：2019-02-14

申请号：US15834676

申请日：2017-12-07

申请人： Samsung Electronics Co., Ltd.

发明人： Hyun Chul Song , Tae Gon Kim , Kyung In Choi , Sun Hong Choi , HanMei Choi , Sang Hoon Han

IPC分类号： H01L21/687 , H01L21/265 , H01L21/67 , H01L21/02 , B23B31/02 , H01L21/683

摘要： A wafer support assembly can include a wafer chuck including a first surface and a second surface, where the first surface can have a central region that is configured to hold a wafer during ion implantation into the wafer, and an edge region surrounding the central region beyond an edge of the wafer when held in the central region, and the second surface opposing the first surface. An edge mask structure can cover at least a portion of the edge region of the first surface, where the edge mask structure can have a mask body with an inclined side surface facing the central region.