公开(公告)号：US10680025B2

公开(公告)日：2020-06-09

申请号：US15952449

申请日：2018-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Bo Shim ,  Cha Jea Jo ,  Sang Uk Han

IPC: H01L27/146 ,  H01L23/00 ,  H01L27/30

Abstract: A semiconductor package includes a package substrate, an image sensor disposed on the package substrate, and a bonding layer disposed between the package substrate and the image sensor, and including a first region and a second region, the second region has a modulus of elasticity lower than that of the first region and is disposed on a periphery of the first region.

公开(公告)号：US20190103432A1

公开(公告)日：2019-04-04

申请号：US15952449

申请日：2018-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Bo Shim ,  Cha Jea Jo ,  Sang Uk Han

IPC: H01L27/146 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, an image sensor disposed on the package substrate, and a bonding layer disposed between the package substrate and the image sensor, and including a first region and a second region, the second region has a modulus of elasticity lower than that of the first region and is disposed on a periphery of the first region.