公开(公告)号：US20190103432A1

公开(公告)日：2019-04-04

申请号：US15952449

申请日：2018-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Bo Shim ,  Cha Jea Jo ,  Sang Uk Han

IPC: H01L27/146 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, an image sensor disposed on the package substrate, and a bonding layer disposed between the package substrate and the image sensor, and including a first region and a second region, the second region has a modulus of elasticity lower than that of the first region and is disposed on a periphery of the first region.

公开(公告)号：US11244936B2

公开(公告)日：2022-02-08

申请号：US16439409

申请日：2019-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Hyeok Im ,  Hee Seok Lee ,  Taek Kyun Shin ,  Cha Jea Jo

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/498 ,  H01L23/13 ,  H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L29/06 ,  H01L23/367

Abstract: A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole.

公开(公告)号：US10680025B2

公开(公告)日：2020-06-09

申请号：US15952449

申请日：2018-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Bo Shim ,  Cha Jea Jo ,  Sang Uk Han

IPC: H01L27/146 ,  H01L23/00 ,  H01L27/30

Abstract: A semiconductor package includes a package substrate, an image sensor disposed on the package substrate, and a bonding layer disposed between the package substrate and the image sensor, and including a first region and a second region, the second region has a modulus of elasticity lower than that of the first region and is disposed on a periphery of the first region.